A Scanning Acoustic Microscope (SAM) is a precision tool that uses high-frequency sound waves to inspect the internal structures of materials without causing damage. This technique is widely employed in various industries, including semiconductors, electronic packaging, and materials science. SAM can effectively identify internal defects, delamination, cracks, and welding quality issues.
The process involves emitting high-frequency sound waves that interact with different materials and interfaces within the sample. These waves reflect or scatter when they encounter changes in material properties, allowing the microscope to capture these signals and generate detailed images of the internal structure. This makes SAM particularly useful for non-destructive testing and quality control in manufacturing processes.
In the semiconductor industry, SAM helps detect flaws in chips and bonding layers, ensuring reliable performance. For electronic packaging, it identifies voids and delamination, which are critical for product reliability. In materials science, SAM aids in analyzing composite materials and their interface integrity. Additionally, it finds applications in biomedicine for tissue imaging.
By providing clear images of internal features, SAM enhances quality assurance and research capabilities across multiple fields. Its non-destructive nature ensures that samples remain intact for further testing or use.