Shenyang Heyan Technology Co.,Ltd

Shenyang,  Liaoning 
China
http://www.heyantech.com
  • Booth: L1111

Greeting, We are happy to welcome you as a new client !

Overview

Heyan Technology Co.,ltd dedicated 40 years in the self-develpment and manufacture high precision dicing saw machine ; Our "DS series" dicing saws are put in production by 600+ customers worldwide, our machine users such as semiconductor micro-assembly OSAT companies, wafer fabs ; LED fabs and assembly companies ; Power discrete producers, Sensors& MEMS devices manufacturers with wide industrial applications in Telecom, Optics & Imaging, Medical detection, Defense, 3C Electronics and so on..

Until year 2022, The company has delivered more than 4500+ dicing saws to more than 600+ clients worldwide. The company has 400+ employees, with a strong R & D teams of 150+ engineers as well as 100+ service team, self-owned 23000m² standard production plant (2 more plant in future to build), set up in Suzhou R & D service center, 9 domestic service centers, and 2 authorized agents in overseas markets. 

The HEYAN "DS series" dicing solutions have more than 15+ models : 
- Full range semi-auto wafer saw for 4‘’ ~12" (150mm~300mm) wafers
- Fully automatic models for 8",12" wafers 
- Tape-less saw JS2800 for BGA, QFN, DFN, LGA package, with integration of vision inspection and sorting offload.
- DS9261H high precision half-cut saw, with trimming wafer edge function, used for DBG process of super thin wafer.
- DS9260R wafer ring cut model, remove wafer thick edges ring
- QM800 lead frame cutting - removal - tape mounting system, automatic remove copper lead frame edges before tape sawing
HEYAN support client dicing production with all kinds of peripheral equipment, such as tape mounter, cleaning machine, UV debonder, Co2 injector, etc.
Heyan release it's back thinning grinder machine, with 1 spindle and 2 spindles fully automatic models, Heyan dedicated to become top class dicing & grinding solution providers in the world.

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