Solar Plus Company

Taichung,  Taiwan
https://en.solarplus-tape.com
  • Booth: B2823

Semiconductor tape from Taiwan

Overview

Founded in 1980, Solar Plus Company fabricates high performance tapes and adhesive films. In order to become the strongest supporter for semiconductor industry in Taiwan. We provide processional consulting and custom made service. Our hot selling semiconductor tape includes, UV release tape, wafer back grinding tape, substrate dicing tape, thermal release tape, PI tape. We also provide automobile application tape, medical tape,  insulation tape, bicycle tubeless rim tape, helicopter tape and variety industrial tape. 

At Solar Plus company, we take the Customer-First Principle as our top priority, we can make product designing, processing, manufacturing according to customer demands and offer OEM services.

  Products

  • Double side UV release tape
    One side UV release adhesive, the other side with thermal release adhesive. Or double side UV release adhesive tape...

    • Solar plus company produces UV release tape (dicing tape) for semiconductor production process. UV release tapes are used in wafer back grinding or wafer dicing. After UV light curing on the tape, the adhesion drops and let the tape release from the substrate. It has been used wildly in semiconductor front end production process.
    UV double side tape is the newest inquiry in semiconductor industry recently.

    How to shorten the time in the production process for semiconductor industry, is the most important project that Solar plus is focusing on.

    ♠ After UV light exposure (with certain wave length), the adhesion is greatly reduced (irreversible reaction), the object can be easily removed and picked up.

    ♠ Used for any production process.

    ♠ Different release liner design for distinguish A & B sides.

    ♠ Low energy release, speed up the production process.

    ♠ Anti-static version is available.

    udd-utd-series-en.png

  • Thermal release tape
    Thermal release tape can be made as regular tape structure or double side tapes....

    • As a Semiconductor tape manufacture in Taiwan, thermal release tape is one of Solar plus company important product. The thermal release heating up temperatures are 85~260°C.

    The application is suitable for any phase of semiconductor produce process or traditional industry.

    Sandwich type of thermal release tape :

    ♠ Double side with foaming adhesive, for any production process, as carrier or temporary fixing.

    ♠ Single side foaming adhesive, for any production process, as carrier or temporary fixing.

    ♠ Thermal release temperature: 85~260°C 

  • Wafer Back Grinding Tape / Dicing Tape
    Solar Plus company produce the best wafer back grinding tape (BG tape) from Taiwan. Wafer back grinding tape requires high flatness and fine elongation....

    • Solar Plus company produce the best wafer back grinding tape (BG tape) from Taiwan. Wafer back grinding tape requires high flatness and fine elongation. As we know in the post pandemic era, there is a large demand of 3C product and 5G industry. Taiwan is well known as a leading country in semiconductor industry. Solar plus company provides custom made service and professional consulting.

    We evolve beyond Moore's law with you.

    ♠  High flatness and great elongation for wafer back grinding / thinning protection, substrate cutting.

    ♠ For uneven surface masking protection.

    ♠  Acid and alkali-resistance : PH 3 ~ PH10.

    ♠  Lift-off cleaning. 

    Model Material Physical Property Applications
    POY143 PO + Liner Total Thickness 170 µm Wafer back grinding / thinning
    Adhesion 0.15±0.1 kg/in
    POR146 PO + Liner Total Thickness 170 µm Wafer back grinding / thinning
    Adhesion 0.35±0.1 kg/in
    POL803 PO + Liner Total Thickness 95 µm Wafer dicing, substrate cutting
    Lift-off cleaning
    Adhesion 0.2±0.1 kg/in
    POL804-2 PO + Liner Total Thickness 87 µm Wafer back grinding / thinning
    Substrate cutting
    Adhesion 0.06~0.12 kg/in
    POL835 PO + Liner Total Thickness 93 µm Die cutting protection
  • Polyimide Tape
    For high temperature masking function PI tape....

    • ♠ Used in masking operation during wave solder process on PCB, prevent electroplating liquid immersion and polluting.
    ♠ Insulation and high heat dissipation for lithium battery wrapping.
    ♠ Wiring in heater, power supply and flexible printed circuit board.
    Model Material Physical Property Applications
    KA105
    KA105#50
    KA105#125    		  PI Film+Silicone Thickness 57 µm Different film thickness
    (25、50、75、125µm)，
    with or w/o liner
    For PCB gold finger masking,
    painting masking
    Thickness 86 µm
    Thickness 161 µm
    Adhesion 0.5 ↑ kg/in
    Temp. 290 ℃
    KA104
    KA104#50     		  PI Film+Silicone Thickness 61 µm For PCB gold finger masking,
    painting masking
    Thickness 86 µm
    Adhesion 0.65 ↑ kg/in
    Temp. 260 ℃
    KA214  PI Film+Silicone Thickness 35 µm Low adhesion for fixing
    Adhesion 0.1-0.15 kg/in
    Temp. 260 ℃
    KA105RP  PI Film+Silicone Thickness 61 µm
    Adhesion 0.5↑ kg/in
    Temp. 290 ℃
    KA102  PI + Acrylic Thickness 56 µm Lithium battery wrapping
    Adhesion 0.7 ↑ kg/in
    Temp. 180 ℃
    KAL268  PI + Acrylic Thickness 57 µm Lithium battery wrapping
    Adhesion 0.7 ↑ kg/in
    Temp. 180 ℃
    KAL605 PI Film+Silicone
    w/ Liner    		 Thickness 61 µm Chip in high temperature process and soaking
    Adhesion 0.5 ↑ kg/in
    Temp. 290 ℃
    PSA Anti-static 108~1011 Ω/sq
    KA605AS PI Film+Silicone Thickness 61 µm Chip in high temperature
    process and soaking
    Adhesion 0.5 ↑ kg/in
    Temp. 290 ℃
    PSA Anti-static 108~1011 Ω/sq
    Film Anti-static 103~108 Ω/sq
  • QFN tape
    QFN tape is made from PI film, the Quad Flat No leads package process requires high cleanness and temperature resistance.
    Solar Plus company keep inventing the best QFN package tape for any custom made project....

    • ♠  Used in QFN molding process, to avoid EPOXY bleeding.
    ♠  Polyimide film coated with special formulated silicone adhesive. 
    ♠  Consistently stable at high temperature, no residue after peeling off.

    Product Code Product Description Physical Property Applications
    KAL278 PI Film w/ liner Total Thickness 33 um QFN molding process
    Adhesion 0.1  kg/in.

Categories

300 Materials, Assembly
  • Tape & Reel Materials
    • 400 Components, Parts & Accessories
  • Raw Material & Custom Components; Plastic
    • Loading ...

    :
    :


    Legend
    Available Timeslot
    Scheduled Appointment
    Personal Appointments
    Appointment Request
    Blocked Timeslot
    Restricted Timeslot
    Cancelled
    Declined
    For Technical Support with this webpage, please contact support.