Suzhou Xinhe Semiconductor Material Co.,Ltd

• Booth: B2808

Chip bonding materials for IC packaging and LED packaging

Overview

Suzhou Xinhe Semiconductor material is mainly engaged in the R&D and manufacturing of semiconductor chip bonding materials, namely capillary, capillary are widely used in semiconductor IC packaging and LED packaging. It is the core material of chip packaging and bonding process.
The company is focusing on ceramic capillary for mid-to-high-end market research and manufacturing. In ceramic raw material preparation, molding process, surface treatment, equipment research and development and other aspects of the core technology completely independent and realized mass production, has passed the certification of several major customers at home and abroad and obtained orders.
The company is focusing on the high-precision ceramic industry, our conpany is committed to becoming the global leader in bonding materials for semiconductor chips.

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