TANAKA PRECIOUS METALS

Chuo-ku,  Tokyo 
Japan
https://www.tanaka.co.jp/english/
  • Booth: B2018

See where precious metals are used in SEMICON at Booth B2018

Overview

TANAKA Precious Metals is developing its precious metals business in the three areas of industrial uses, assets and jewelry.

There are a wide variety of industrial-use applications, with industrial precious metal products we are developing ranging from everyday automotive, mobile and other devices, to cutting-edge energy, medical and aerospace. Our asset-use applications include bullion and other asset products, while our jewelry use applications include many items polished to a strict quality level unsurpassed in this industry.

TANAKA’s precious metals make the lives and lifestyles of people shine in all walks of life.

  Products

  • Precious metals products for Semiconductor
    From Bonding Wire, Brazing filler, Encapsulant, ALD Precursors, Sputtering targets, Plating chemicals, to Probe Pin & Ag adhesive, TANAKA products finds application in many semiconductor fabrication process!

    Click "More Info" to see the overview pamphlet!...

    • TANAKA, with its leading expertise as a precious metal company, is the world's largest provider of Bonding Wires. In addition, we provides a whole range of different materials that are used in the semiconductor field.

    Scan the QR code in our pamphlet for more details!

    • ALD Precursors
    • Sputtering targets
    • Plating chemicals
    • Probe Pin Material
    • Bonding Wire
    • Brazing filler materials
    • Encapsulant, Evaporation materials
    • Ag adhesive
    • Recycling

Categories

200 Equipment, Assembly
  • Ball Placement; Attach Systems
  • Die Bonding; Attach Equipment
  • Wafer Level Bonders
  • Wire Bonding Equipment
    • 207 Equipment, Process
  • Plating; Electro Chemical Plating; Deposition Systems
    • 208 Equipment, Test
  • Logic Test Systems
  • Memory Test Systems
  • Package Test Systems
    • 300 Materials, Assembly
  • Adhesives; Epoxies; Die Attach Compounds; Under fill Materials; Conductive & Non-Conductive
  • Bonding; Interconnect Materials - Wire; Ribbon; Tape; Capillaries & Tools
  • Molding; Encapsulation; Potting; Resin Materials
  • Packages; Ceramic and Other High Temp compounds
  • Solder; Solder Balls and other Soldering Materials
  • Tape & Reel Materials
  • Thermal Interface Materials; Heat Sinks
  • Thick Film Pastes; Materials
  • Thin Film; Dielectric Film Materials
    • 301 Materials, Chemicals & Solids
  • Acids; Etchants
  • Buffers; Alkalis; Bases
  • Solids
    • 307 Materials, Process
  • Deposition/Target Materials
  • Plating Materials
    • 700 Manufacturing Services
  • Plating; Electro Polishing; Coating; Surface Treatment
  • Reclaim Services (Evaporation; sputtering source material; Precious metal reclaim; Scrap; Vacuum pum
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