Test Research, Inc. (TRI)

Penang,  Malaysia
http://www.tri.com.tw
  • Booth: L2632

SEMI & Advanced Packaging Industry Inspection

Overview

Founded in 1989, Test Research, Inc. (TRI) is the World's leading brand in Test and Inspection Solutions in the PCBA Manufacturing Test & Inspection Industry. Test Research, Inc. offers the most robust product portfolio in the industry for automatic test and inspection solutions. From Solder Paste Inspection (SPI), Automated Optical Inspection (AOI), and 3D AXI systems to Manufacturing Defect Analyzers (MDA) and In-Circuit Test (ICT) equipment, TRI provides the most cost-effective solutions to meet a wide range of manufacturing test and inspection requirements.

TRI provides Test and Inspection equipment for multiple electronics manufacturing, from Automotive, Medical, and Consumer electronics to Advanced Packaging & Semiconductor manufacturing. TRI's inspection solutions offer Smart Programming, Multiple 3D Technologies, Metrology measurements, and AI-Powered Algorithms.

TRI SEMI Inspection Functions
Die Bonding
Missing, Orientation, Rotation, Shift, Tilted, Chipping, Crack, Scratch, 
Bond line thickness, Epoxy on Die, Epoxy Coverage, Epoxy Height
Wire Bonding
Broken, Short, Sweep/Sink, Missing, Sway, Collapse, Loop Height
Sagged Wire, Cross Wire Gap, 
Wire Tracing, Ball Bond Diameter
Ball Placement, Stitch Width, Stitch Coverage over Ball
Ball-off Pad, Ball touch Pad Distance, Clubbed Ball, Ball Thickness
Lifted Ball, Low Landing, 
Bond on Contamination
Bonding Area/Pad
Copper Protrusion, Crack, Chipping, Exposed Copper, Exposed Nickel, 
Target Material, Scratches or Brush Marks, Oxidation
Molding / Underfill Materials 
(EMC, CUF, NCP, NCF, MUF)
Area coverage, Dimensions, Surface, Void, Damage, Crack, Scratches, 
Delamination, Contamination, Surface particles
Patterned Wafer Residues, Crack, Scratch, Particle, Pad Abnormal, Discolor, Contamination, Peeling,
Probe Mark Defect, CD Measurement
Bump Wafer 2D Bump Size, 3D Bump Height, Bump Defect, Foreign Material, CD Measurement
Wafer Frame Chipping, Crack, Scratch, Particle, Contamination, CD Measurement, Saw 3D metrology

For Technical Support with this webpage, please contact support.