Welcome to ACCRETECH = ACCRETE + TECHNOLOGY
Overview
Tokyo Seimitsu Co., Ltd. (Accretech) provides high quality and cutting-edge technology solutions in semiconductor industry.
With the motto of "Win-Win Relationship", Accretech strives to create the world's No. 1 products with our business partners!
Accretech offers diverse product portfolio in semiconductor material processing, notably conventional mechanical blade dicing & high requirement laser dicing process. Our Polish-Grinder & HRG serves as comprehensive solution with high throughput & accuracy in wafer thinning and damage-less removal.
In front end wafer fabrication process, Accretech's probers have proven track of stability with wide range of tester platform.
Always adapting the huge & dramatic changes in semiconductor industry, Accretech's product is unparalleled in the market with the synergy of two business pillars of Metrology & Semiconductor Manufacturing Equipment.
Visit Level 1 booth L2009 to create the World's No. 1 products with us!