BPE SYNERGY ENGINEERING SDN BHD

Melaka,  Malaysia
http://www.bpese.com
  • Booth: L2605

Overview

Founded in 2012 by a group of electronics industry professionals, Our Growth Story - BPE Synergy Engineering began as a specialist in the repair, design, fabrication and assembly of printed circuit boards (PCBs) and mechanical hardware. Today, BPE delivers a full suite of turnkey solutions for engineering applications, operations, and project management. We have an expanding team of technical service experts stationed at major electronics manufacturers all over Malaysia and at our main facilities in Melaka.

This year, partner with Suzhou UIGreen Science and Technology Co., Ltd, BPE and UIGreen for the very first time appear in the SEMICON fair Malaysia. UIGreen is a high-tech enterprise devoted to miniature precision manufacturing. The products are widely applied in many advanced manufacturing areas such as MEMS miniature precision manufacturing, semiconductor chip testing, new energy automobile and medical apparatus. Through continuous investment and exploration in the field of miniature precision manufacturing technology, the company has accumulated many core technology and product patents.


  Products

  • UIG X Series High-speed Coax Socket
    Application Markets: AI, HPC, CPU, GPU, Interface Chip...

  • Specification:

    • Pitch: ≥ 0.35mm;
    • Special insulating material with superior durability & high rigidity;
    • Insert loss S21: >45-80GHz@-1dB;
    • Return loss S11: >45-80GHz@-10dB.

    Advantages:

    • Competitive cost of test;
    • Customized;
    • Simulation capability & accuracy;
    • Local regional support;
    • Mature high volume mass production.
  • UIG Z Series RF IC Test Socket
    Application Markets: PA, Switch, WIFI, LNA, Bluetooth, Audio Chip...

  • Specification:

    • Pitch: ≥ 0.3mm;
    • Current carrying capacity : ≥ 3~5A;
    • Low resistance, self-induction, high-wearing feature and self-cleaning;
    • Insert loss S21: > 15-40GHz@-1dB;
    • Return loss S11: > 11.8-40GHz@-10dB;
    • Suitable for QFN/DFN & LGA package.

    Advantages:

    • Competitive cost of test;
    • Customized;
    • Local regional support;
    • Own patents.
  • UIG WLCSP Probe Head / Socket
    Application Markets: Different kinds of IC in wafer level...

  • Specification:

    • Pitch: ≥ 130um;
    • Tip depth: ≥ 2.15mm;
    • Current carrying capacity: ≥ 0.5~3A;
    • Multi-pin & multi-site test;
    • Kelvin test is available;
    • Ceramics & engineering plastics.

    Advantages:

    • Competitive cost of test;
    • Customized;
    • Local regional support.
  • UIG High Current Socket
    Application Markets: Power Converter, Power Converter, Sensor Chip...

  • Specification:

    • Pitch: ≥ 300um;
    • Current carrying capacity: ≥ 4-6A;
    • Contact stability;
    • Kelvin testing solution is available;
    • QFN, DFN application is available;
    • Floating base structure is suitable for SOP package.

    Advantages:

    • Competitive cost of test;
    • Customized;
    • No need PCB redesign;
    • Local regional support;
    • High current with Tri-temp test capability.
  • UIG Pogo Pins
    2000+ series pins...

  • min. pitch 0.11mm; min. length 1.4mm
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