Advanced Packaging Interlink Holding Pte Ltd

Key Features:

● High Precision: Delivers industry-leading ±5μm placement accuracy, ensuring reliable and precise results.

● Ultra-Thin Die Handling: Capable of handling die thicknesses as low as 25μm, facilitating the creation of compact and high-performance devices.

● High Stacking Capability: Supports stacking up to 32 layers, meeting the most demanding packaging requirements.

● Advanced Process Support: Fully compatible with DAF (Die Attach Film) and epoxy processes, offering flexibility in assembly methods.

● Smart Factory Integration: Fully supports Industry 4.0 with SECS/GEM traceability and real-time data monitoring for optimized operational efficiency.

Ultra-Thin Die Handling – As devices become smaller and more powerful, the handling of ultra-thin dies is essential. API’s Die Attach technology is built to manage dies as thin as 25μm, enabling manufacturers to handle all-size dice with precision and create next-gen devices with unmatched accuracy.

Revolutionizing On-Machine AOI with AI-Powered Precision – In the field of advanced manufacturing, our AI-Driven Detection Technology is transforming the die attach process. Powered by deep learning algorithms, our system acts as an intelligent inspector, monitoring every step in real-time. It precisely identifies and corrects even the slightest deviations, ensuring unparalleled accuracy in die attach operations. This not only minimizes errors but also sets new standards for production quality, enabling us to deliver superior results in every manufacturing cycle. 

SECS/GEM Industry 4.0 Integration – APIE is at the forefront of the smart factory revolution with full SECS/GEM integration, offering a one-stop solution for real-time data monitoring and traceability. This enhances operational efficiency and ensures consistency in every stage of production.

HIGH PRECISION:XY Placement: ±3μm@3σ;Theta Rotation: 0.07°@3σ;Force Control: 0.1N - 25N±10%;Precise BLT Control.

HIGH SPEED:Industry-Leading UPH;Extremely User-Friendly;High Speed Mode with ±10μm Placement.

HIGH FLEXIBILITY:Easy Process Changing;Easy Product Conversion;Auto Tool Changing.

HIGH INTELLIGENCE:Support SECS/GEM, Inline, OHT, AGV;Post-Disp/Bond Smart Inspection;FM/Crack Detection;Machine Health Self-Checking.

HIGH PRECISION:Placement Accuracy: ±1.5μm@3σ;Precise Bond Line Thickness Control;Compatible for Both TC-MUF and MR-MUF Processes, min.Pitch≥20μm.

HIGH SPEED:Single TCB, BH 2x, UPH≥1500; Dual TCBs, BH 4x, UPH≥3000;Heating Rate ≥ 200℃/s, Cooling Rate ≥ 70℃/s;EFEM with Multi-loadports, Supports Various Wafer Loading/Unloading.

FLUXLESS:Low Temperature Atmospheric Plasma to Remove Metal Oxide;Wafer-level /Chip-level Plasma Treatment (Both Sides);N2 Shielding (O2 < 50ppm),  Precise Chamber Temperature Control;No Flux Cleaning, Suitable for Fine Pitch Flip Chip Bonding.

HIGH FLEXIBILITY:Compatible for Both Flux Dipping and Fluxless Modes;Compatible for CoW/CoS;Compatible for Wafer/Tape & Reel/Tray Loading;Single TCB/Dual TCBs/TCB-Vacuum Formic Acid Reflow System.