1.Pioneer of uball bumping method (Since 2005)
Established solder ball bumping technology in cooperation with major IC manufacturers and equipment and material manufacturers.
2. Support process and production in cooperation with related companies
When problems occur during production, we can support the process introduction and production in cooperation with material and equipment makers.
3. Bumping solution ( uball & Pillar )
We have experience with various wafer(including compound wafer)