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Maxell Asia (Singapore ) Pte Ltd

Singapore,  Singapore
https://www2.maxell.co.jp/
  • Booth: B2640

Welcome to Maxell, Within the Future

Overview

The company name Maxell originates from the brand name "Maxell" (Maximum Capacity Dry Cell = dry cell with the highest performance) created for the dry batteries that constituted its business at the time of foundation.

We specialize in the manufacturing and sales of batteries, functional materials, optical components, devices, and electrical appliances.

Electro-Fine-Forming (EF2) is the technology combining Photolithography with Plating technology that enables midation.

We are enthusiastic to introduce our electro-forming, dicing and BG tape products.

Lead Frame

Stencil

Tooling Jig & Multi layer stencil (with Electro-Formed Mesh)

Tooling Jig (Alternative proposals for machining tooling)

Package foundry

Dicing Tape and Back grinding tape


  Products

  • Electro-Fine-Forming (EF2)-Lead Frame
    Lead Frame...

  • Lead Frame

    1. Thin and minimalize 

         Approx. 30% reduction in thickness compared to etched products mass production size: 0603PKG

    2. Possible to divert the customer's existing equipment.

         Outline can be formed according to the equipment. Ex. Strips, wafer shapes, etc.

    3. Significant advantage flexible to design lead position, so that achieve multi-rows QFN PKG.

  • Electro-Fine-Forming (EF2)-Stencil
    Stencil...

  • 1.Pioneer of  uball bumping method (Since 2005)

    Established solder ball bumping technology in cooperation with major IC manufacturers and equipment and material manufacturers.

    2.   Support process and production in cooperation with related companies

    When problems occur during production, we can support the process introduction and production in cooperation with material and equipment makers.

    3. Bumping solution ( uball & Pillar )

    We have experience with various wafer(including compound wafer)

  • Electro-Fine-Forming (EF2)-Tooling Jig
    Tooling Jig (Alternative proposals for machining tooling...

  • Tooling Jig (Alternative proposals for machining tooling)

    1. Plating shape realize excellent removal during moulding

    2. Multi-layer electroforming with high positioning accuracy

    3. Realize thickness accuracy with polishing technology

  • Electro-Fine-Forming (EF2)-Package Foundry
    Package Foundry...

  • Maxell's Package Foundry specializes in high mix low volume production of FOWLP and WLCSP.

    We provide Cu rewriting package fabrication by utilizing both technologies semiconductor front-end process and plating.

    We also have experience in packaging compound semiconductors such as SiC and GaN other than silicon.

  • Dicing Tape and Back grinding tape
    Supporting Semiconductor Manufacturing Processes with Diverse Products...

  • Back Grinding Tape

    ・High conformability minimizes dimples and protects wafer surfaces.

    ・PET backing helps prevent wafer warpage.

    ・Special adhesive achieves both high adhesion and easy removal.

    ・Low risk of bump damage and adhesive residue during removal.

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