cts GmbH

Apollu

Automated Handling for Polishing and Lapping Processes

Handling wafers during the polishing and lapping processes is a critical point in semiconductor manufacturing. It determines whether your products achieve the highest surface quality and dimensional accuracy. At the same time, manual interventions pose a high risk of damage and contamination.

Apollu addresses this challenge: with a camera-based positioning system that automatically detects and handles wafers with high precision, and a fast cycle time, it ensures maximum efficiency and process reliability. The solution integrates seamlessly into your existing production line and supports wafer sizes from 150 to 300 mm, regardless of the machine manufacturer.

Apollu meets ISO-7 standards for cleanroom operations and offers a quick setup time to flexibly respond to changing production requirements. The result: stability, quality, and a significant relief for your employees.

Auto Bagging Tool (ABT)

Fully Automated Packaging Solution for FOSBs & FOUPs

Packaging Front-Opening Shipping Boxes (FOSBs) and Front-Opening-Universal-Pods (FOUPs) is a critical step in semiconductor manufacturing, where high precision and safety are required. Our ABT system automates the entire packing process - from identification and leak testing to labeling, ensuring error-free and efficient handling.

The ABT system uses Code identification, ensuring that each FOSB & FOUP is correctly assigned to the corresponding wafers. Automated checks, such as cross-slot checks and 100% leak tests, minimize the risk of transport damage. An integrated labeling system ensures that packing meets the highest standards and all information is properly documented.

Thanks to its SECS/GEM compatibility, the ABT system integrates seamlessly into existing production lines without requiring extensive adjustments. It is ideal for manufacturers who prioritize speed, safety, and cleanroom standards.

Manual Bagging Tool (MBT)

Semi-Automatic Packaging for Smaller Batches

The MBT system is designed for production lines that require flexibility to handle changing demands and smaller batches. Unlike the ABT system, MBT combines manual input with automated core processes, which is particularly useful for test batches, prototypes, and custom orders.

Thanks to its compact design and ease of use, the MBT system is ideal for companies looking to improve their packaging processes efficiently without large investment costs. Even for smaller quantities, it ensures the same high standards as mass production, including automated leak testing and flexible container adjustment.

Smart Warehouse / Mini

Optimal Storage of Wafer Boxes in Limited Space

Semiconductor production requires high precision, even when storing sensitive components like FOSB, FOUP, and wafer boxes.

Our Smart Warehouse / Mini is specifically designed to organize these critical materials in a space-saving and secure way. It offers fully automated inbound and outbound interfaces to accelerate material flow and enables real-time tracking of every container. Thanks to its modular design, it can be flexibly adjusted to meet growing demands and can fit into cleanroom environments when necessary.

Smart Warehouse / Big

Maximum Capacity for FOSB, FOUP, and Wafer Boxes

Semiconductor production is under increasing pressure to keep up with global competition while maintaining the highest quality and efficiency standards.

With our Smart Warehouse / Big, we help companies reliably supply their production lines with FOSB, FOUP, and wafer boxes—even with increasing demands and short delivery times.

With scalable capacities, automated material flows, and a space-saving design, we optimize your storage processes and minimize material shortages. This ensures your production remains flexible and efficient, even in a dynamic market environment.