ADVANCED SEMICONDUCTOR EQUIPMENT TECHNOLOGY SINGAPORE PTE. LTD

Singapore,  Singapore
http://www.asets.com.sg
  • Booth: L1627

Welcome to ASETS Pte Ltd.

Overview

Advanced Semiconductor Equipment Technology Singapore (ASETS) Pte Ltd is a Singapore-registered company that conducts sales, assembly, and repair of semiconductor equipment for the semiconductor manufacturing industry. It has licensing agreements with OEMs to conduct sales, assembly, and service of its equipment.

ASETS also has a Lab facility to conduct customer Demo, process research and development, and perform equipment CIP.

We are wholly founded by employees and management staff with many years of industry experience. Our mission is to be the equipment of choice for the semiconductor manufacturing industry.

  Products

  • Primo D-RIE®  
    Dielectric Etch Tool...

    • •First-generation dielectric etch system.
    •300mm cluster tool with up to three dual-station process modules.
    •Each module processes two wafers simultaneously.
    •Designed for all dielectric film stacks.
    •Cost-effective with high performance in mass production.
  • Raintree Metrology Solutions
    Ellipsometry-based thickness measurement tools...

    • The semiconductor equipment manufacturing company Raintree Science Instruments (Shanghai) Co., Ltd. is situated in Shanghai's Pudong New District's Zhangjiang High-Tech Park. Raintree and ASETS are dedicated to offering metrology tools for thickness measuring in the global market.
  • Primo AD-RIE®
    Second-generation dielectric etch system....

    • •Second-generation dielectric etch system.
    •Features switchable dual-low-frequency RF generator and multi-zone gas distribution.
    •Configurable with up to three dual-station process modules.
    •Used for 40-7nm BEOL and 10nm FEOL applications.
    •Offers excellent process control, tunability, and stability.
  • Primo iDEA®
    Integrated Dual-station Etch and Asher....

    • •Integrated Dual-station Etch and Asher.
    •Combines D-RIE or AD-RIE process modules with a Downstream Asher (DsA) chamber.
    •DsA uses a remote plasma source for photo-resist removal.
    •Reduces plasma exposure to wafers.
    •Offers a cost-effective solution for etch processing and photo-resist removal.
  • Primo TSV®
    First high-density plasma TSV etch product for MEMS and Through Silicon via applications
    ...

    • •First high-density plasma TSV etch product for MEMS and Through Silicon via applications.
    •Cluster configuration with up to three dual-station process modules.
    •Capable of etching holes with CDs ranging from microns down to <1um.
    •Generates diverse profiles (vertical, cone-shaped, tapered).
    •Offers high-productivity for deep silicon etching.
  • Prismo UniMax® MOCVD
    MOCVD solution for advanced display application with high-volume Mini LED production...

    • With its patented architecture, the Prismo UniMax® MOCVD system can accommodate up to 4 reactors and process up to 108x4” or 40x6” GaN based Blue/Green Mini LED wafers simultaneously. It is extendible to process 164x4” or 72x6” wafers through susceptor configuration change, and is also capable for 8” wafer processing. Each reactor is controlled independently ‒ a novel design that enables exceptional manufacturing flexibility. The Prismo UniMax® MOCVD system is engineered for high performance Mini LED production with its innovated local temperature adjustable heating system. It can deliver excellent wavelength uniformity and good reliability for Mini LED production. With its 785mm diameter susceptor, the Prismo UniMax® MOCVD system can significantly improve the production throughput and reduce the cost of ownership.

Categories

203 Equipment, Inspection & Measurement
  • Film Thickness; Thickness; Uniformity Measurement; Ellipsometer
    • 204 Equipment, Mems
  • Deep RIE etching; Dry etching
    • 207 Equipment, Process
  • Deposition; Chemical Vapor (CVD); MOCVD; PECVD; ALD/REALD; LPCVD; MVD
  • Etching; Stripping; Ashing - Dry and Wet Equipment
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