WinWay Technology Co., Ltd.

Test Socket: WinWay high performance test socket can be fully customized according to customer's need, in terms of alloy materials, probe structure and electroplating. Our test socket can support various testing requirements, such as high frequency/high speed and cater to a wide temperature range.

Burn-in Socket: Burn-in sockets are suitable for mainstream test furnaces. With our proven design capabilities, we can provide customized burn-in sockets for automated testing equipment. We possesses cutting-edge simulation capabilities for signal integrity, PI, heat conduction, heat convection, structural stress and adaptability. Preliminary assessment and comprehensive testing solutions that are in compliance with reliability testing standards (such as H/LTOL, HAST, and THB) are provided to our customers.

PoP Socket: Our PoP socket can test 0.35mm to 0.5mm pitch devices and meet electrical performance of LPDDR4 (4.2 Gbps). Its embedded coaxial structure has passed mass production verification, possesses high frequency electrical properties and excellent heat conductivity. It can also be used for mass production testing for the chip core temperature range of -20℃ to 105℃.

CRS Socket: CRS(Conductive Rubber Sheet) socket cater to high-performance testing needs that includes low inductance, low resistance and low elasticity. The product does not damage the circuit boards and solder balls. Frequent cleaning is not required and the ease of disassembly provides a cost-effective testing solution for high pin count products.

Heatsink Lid: In response to the cooling needs of high-power chips, WinWay developed air-cooled and water-cooled manual lids. The heat generated by the chips can be effectively transported through the heat-conducting materials and liquid medium, maintaining the temperature within the target levels. The maximum cooling power of the heat pipe air-cooled manual lid complies with the cooling needs of 850W.

Manual Lid: WinWay's universal manual lid solutions can be used for laboratory and engineering batch trial production to test different IC sizes and packaging types. Through extensive testing experience and outstanding design capabilities, WinWay pays great attention to the functions and ease of use of manual lids, ensuring stable contact with different packaging types to satisfy preliminary verification needs. Our vast designs of manual lids can meet different testing needs.

Vertical Probe Card: Currently, to meet the trend of high-precision miniaturization, WinWay has created miniature probes for micro-electronic mechanical processing.

WLCSP Probe Card: The WLCSP probe card was designed to meet the needs of high-performance wafer probing. The probe provides short electrical length, high current resistance, and ease of maintenance and replacement. It can conduct function testing and error detection on a single chip through the precise manual lid design, optimizing IC functions before mass production. The current minimum spacing for testing is 0.12mm.

ATC: ATC is an active thermal control unit that uses thermoelectric chips to control the temperature during testing. It offers rapid temperature responses, precise and high-efficiency temperature control. ATC also has a wide temperature range and can be used in both mass production and engineering testing. It can support sorting machines and I/O interface communications. ATC optimizes the control circuit. Its service life is longer than other similar products in the market and has lower maintenance costs.

HEATCon Titan: HEATCon Titan is a high-efficiency active temperature control solution. It has high-power heating capacities and good linear flow control, providing excellent temperature control stability. HEATCon Titan is equipped with protective mechanisms such as leakage, protection and water flow interruption notifications, making the testing environment safer and more reliable. In addition, it also supports remote operations and independent control function that meets with customer engineering verification and mass production needs.  (Patent No. TWI860063).

E-Flux 4.0: E-Flux is an active temperature controller based on refrigeration cycle systems, mainly used in engineering testing. During high-power IC testing, it can control the temperature precisely. It has a wide temperature range and can support up to 1,500W devices. The graphical user interface (GUI) supports RS-232 and Ethernet, allowing for remote control from a PC and reducing the testing time for on-site temperature regulation.

Chiller: The chiller is a clean water cooling device for the semiconductor and precision machinery industries. The maximum controllable power of the device is 2,000W (air-cooled) and 7,000W (water-cooled). It can precisely control temperatures to a level of ±0.1°C. Together with the tactile human-machine interface, it can provide temperature, flow, warning messages and parameter assessments for  convenient use and maintenance. This machine is equipped with a filter to remove foreign material in the circulating liquid. The safety protection devices, such as the built-in temperature/pressure/leakage/low flow sensors, the remote control and operation support can satisfy laboratory and mass production needs.

Coaxial Socket: The coaxial socket is a precision product specifically designed for high-speed transmission (up to 224Gbps) and high-frequency testing. It can support both engineering testing and mass production. Its architecture can increase the operating bandwidth, reduce crosstalk and reduce energy reflection and wear. Customized solder ball distances from 1mm to 0.35mm are currently offered.

HyperSocket™: HyperSocket™ is a next-generation product specially developed to meet the sensitive contact resistance test requirements, providing soft contact avoiding damage to solder ball. This structure significantly enhances spring probe's lifetime, reduces cleaning frequency and achieves maximum production efficiency.
Patent NO. TWI862047; TWI862191; CN20570508U