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Qdos Technology Sdn Bhd

Bayan Lepas,  Penang 
Malaysia
http://www.qdos.com.my
  • Booth: L2433

COME VISIT QDOS AT #BOOTH L2433

Overview

We are a leading Malaysian-owned manufacturer of high-end IC substrates and flexible PCBs, delivering cutting-edge solutions for data processing and transmission across global industries.

With over 30 years of expertise, we continuously invest in next-generation technologies across our three advanced factories, ensuring innovation, reliability, and scalability for our partners.

Trusted by global technology leaders, Qdos provides customized design and fabrication services with a flexible, agile business model—supporting everything from low to high volume and complex mix requirements.

Driven by a future-forward vision and strong social commitment, Qdos is your trusted partner in advancing the next wave of interconnect technology.

Let’s innovate together!


  Products

  • 3.5L MIS ABF IC SUBSTRATE
    Coreless substrates with any shape built up vias for wire bonding application, Gallium nitride power management integrated circuits, providing highest thermal management.
    ...

  • Coreless substrates with any shape built up vias for wire bonding application, Gallium nitride power management integrated circuits, providing highest thermal management.
  • COF 2ML Detector Flex-CT Scan
    Via in pad, Cu filled vias 25um to enable Miniaturization and support multichip assembly by flip chip (Cu pillar) in medical display applications.
    ...

  • Via in pad, Cu filled vias 25um to enable Miniaturization and support multichip assembly by flip chip (Cu pillar) in medical display applications.
  • COF 1ML Medical Flex-Digital X-Ray
    Tightest pitch of 35um to enable Au – Au TCB flip chip assembly for medical display application....

  • Tightest pitch of 35um to enable Au – Au TCB flip chip assembly for medical display application.
  • COF-TAB FLEX
    For MEMs die assembly using flying leads and dual access technology. For industrial applications, delivered in gapless reel format for automated die assembly....

  • For MEMs die assembly using flying leads and dual access technology. For industrial applications, delivered in gapless reel format for automated die assembly.
  • CERAMIC_SUBSTRATE
    For Silicon carbide packaging in Insulated-Gate Bipolar Transistor devices and converter modules, EV application.
    ...

  • For Silicon carbide packaging in Insulated-Gate Bipolar Transistor devices and converter modules, EV application.
  • FCBGA SUBSTRATE
    For high I/O current processor application using SAP circuit formation on ABF built up film and SOP finish.
    ...

  • For high I/O current processor application using SAP circuit formation on ABF built up film and SOP finish.
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