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GLTECH Semiconductor Malaysia Sdn. Bhd.

1st Floor 10 Persiaran Bukit Jambul,,  Bayan Lepas Pulau Pinang 
Malaysia
http://www.adt-co.cn
  • Booth: L1829

A one stop solution provider for all your dicing challenges.

Overview

Advance Dicing Technologies (ADT) a renown dicing, grinding as well as dicing blades manufacturer. We emphasize in providing solution rather than selling equipment. We are here to solve your challenges in Semiconductor manufacturing process. Do contact us and speak to our experts for the solutions you desired.

  Products

  • ADT8230
    Fully Automatic 12" Facing Dual Spindle dicing saw...

    • A well-recognized and proven wafer saw system by renown customers for its flexibility, stability and high-performance capabilities built in. 

Categories

200 Equipment, Assembly
  • Backgrind; Slicing; Lapping; Polishing Equipment
  • Cleaning; Washing Equipment for Assembly & Packaging
  • Dicing; Sawing; Scribing; Separation Equipment
    • 202 Equipment, General Use
  • Cutting; Drilling; Laser ablation; Beveling Equipment
  • Lamination; Sheet Laminating Equipment
    • 207 Equipment, Process
  • Cleaning; Washing; Drying Equipment for Substrate; Fab Processing
    • 300 Materials, Assembly
  • Package Substrates; Laminate; Film based
  • Packages; Ceramic and Other High Temp compounds
  • Packages; Plastic
  • Printed Circuit Boards (PCB); Printed Wire Boards
    • 307 Materials, Process
  • CMP; Grind; Lap; Polish; Abrasive materials
  • Quartz ware (Silicon Carbide, Fused Quartz Glass, Sapphire), Ceramic & Oxide Ceramic Fixtures
    • 308 Materials, Substrate
  • Substrate Materials
    • 400 Components, Parts & Accessories
  • Chucks for Wafer and other Substrates
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