YINCAE Advanced Materials, LLC

UF 120LA is a highly filled and high purity liquid epoxy underfill which can flow into narrow gap. UF 120LA is fully compatible with all no-clean solder paste flux residue and pass 5x260°C reflow without any solder joint deformation, and it has performed better than all competitors’ underfill with cleaning process. This material can be used for BGA, flip chip, wafer-level chip scale package application and bare chip protection in a variety of advanced packages such as memory cards, chip carriers, hybrid circuits and multi-chip modules.

The benefits of using UF 120LA are:

• Fully compatible with all no-clean solder paste flux reside

• Eliminating cleaning process and its pollution

• Large cost saving

• Pass 5x260 ºC without any deformation of solder joint

• Better than all competitors’ underfill with cleaning process

• Be able to flow into 20 μ gap

• Snap cure at lower temperature

UF 158HA is a highly filled and high purity liquid epoxy underfill which can flow into narrow gap. UF 158HA is fully compatible with all no-clean solder paste flux residue and pass 5x260°C reflow without any solder joint deformation, and it has performed better than all competitors’ underfill with cleaning process. This material can be used for BGA, flip chip, wafer-level chip scale package application and bare chip protection in a variety of advanced packages such as memory cards, chip carriers, hybrid circuits and multi-chip modules. The benefits of using UF 158HA are:

• Fully compatible with all no-clean solder paste flux reside

• Eliminating cleaning process and its pollution

• Large cost saving

• Pass 5x260 ºC without any deformation of solder joint

• Better than all competitors’ underfill with cleaning process

• Be able to flow into 20 μ gap

• No resin bleeding

 UF 158HA is designed for high production and friendly environment where process speed, mechanical shock and reliability are key concerns.

UF 158A2 is a high-performance thermal underfill solution designed for a wide range of electronic devices. Ideal for CoWoS packages, this versatile material replaces underfill, silver epoxy paste, and thermal pads/paste in one efficient step. It enhances protection and thermal management for critical components, improving the structural integrity of assemblies and reducing stress on solder joints by filling the space between the device and the PCB (Printed Circuit Board).

This encapsulant is perfect for high-reliability applications where temperature cycling, shock, and vibration can threaten the durability of electronic components. UF 158A2 offers exceptional thermal conductivity and high-temperature stability, ensuring optimal performance even in the most demanding environments.

UF 158A2 is a thermally conductive, capillary flow underfill with rapid curing properties, making it suitable for flip chip, chip scale packages, ball grid arrays (BGAs), package-on-package (PoP) applications, and land grid arrays (LGAs). It is also ideal for bare chip protection in advanced packages such as memory cards, chip carriers, hybrid circuits, and multi-chip modules. Designed for high-volume production, it supports fast processes and provides mechanical shock resistance, ensuring excellent temperature cycling performance and reliability.

Key Benefits:

Fast Flow & Easy Application: Perfect for underfilling 100x100 mm chips (with a 20m gap).
Shortens Manufacturing Process: Improves production efficiency.
High Thermal Conductivity: 3-4 W/mK for superior thermal management.
Snap Cure & Reworkable: Provides flexibility and ease of use.
Cost-Effective: Significant cost savings while delivering excellent thermal management performance.
UF 158A2 is the ideal solution for manufacturers looking for a reliable, efficient, and cost-effective material for their thermal management needs.

DA158N is a high-performance die attach adhesive that combines exceptional thermal conductivity with electrical insulation. It is specially designed for fast curing at low temperatures, making it ideal for a wide range of applications, including extreme environments such as space missions, where durability and reliability are critical.

Developed with the vision of supporting future technologies, including those for Mars exploration, DA158N stands out for its unique properties. It offers high thermal conductivity, enabling thin bonding lines without any bleeding or migration issues. Additionally, it provides superior bonding strength and exceptional thermal cycling performance—outpacing leading competitors in the market. DA158N can endure extreme temperatures as low as -273°C without delaminating, maintaining reliable performance in even the harshest conditions.

This adhesive is perfect for all die attach applications, particularly those in harsh environments. It also serves as an excellent protective layer for bare chips in advanced packages, including memory cards, chip carriers, hybrid circuits, and multi-chip modules.

Designed for high-volume production and efficient processes, DA158N excels in environments where speed, reliability, and mechanical shock resistance are key concerns. It is easily dispensed, minimizes induced stresses, and ensures outstanding performance in temperature cycling and mechanical resistance.

Key Features:

• Thermal Conductivity & Electrical Insulation: Perfect for high-performance applications.
• Low-Temperature Curing: Fast curing for efficient production.
• Superior Thermal Cycling Performance: Outperforms competitors in extreme temperature conditions.
• Exceptional Bonding Strength: No delamination, even at -273°C.
• Easy Dispensing & Minimal Stress: Ensures high-quality results with reduced risk of stress-induced failure.

DA158N is the ultimate choice for die attach applications in extreme conditions, offering long-lasting reliability and performance for industries ranging from space exploration to advanced electronics manufacturing.

UF 88UL is a super-fast flow capillary underfill, which can flow into 10μ gap at room temperature without preheating a substrate. After cure, there is void free in underfill. The cured UF 88UL can be easily reworked. UF 88UL not only can be used as a underfill for chip scale package, ball grid array devices, package on package and land grid array and some flip chip application. It is also suitable for bare chip protection in a variety of advanced packages such as memory cards, chip carriers, hybrid circuits and multi-chip modules. It is designed for high production and friendly environment where process speed and mechanical shock are the key concern. This material is easily dispensed, minimizes induced stresses and provides outstanding reliability performance (e.g. temperature cycling performance) and excellent mechanical resistance. The performance of drop test has been improved by two orders of magnitude compared with that with the use of solder paste.

UF 158UL is a super fast flow capillary underfill, which can flow into 10μ gap at room temperature without preheating a substrate. After cure there is void free in underfill. The cured UF 158UL can be easily reworked. UF 158UL not only can be used as a underfill for chip scale package, ball grid array devices, package on package and land grid array and some flip chip application. It is also suitable for bare chip protection in a variety of advanced packages such as memory cards, chip carriers, hybrid circuits and multi-chip modules. It is designed for high production and friendly environment where process speed and mechanical shock are the key concern. This material is easily dispensed, minimizes induced stresses and provides outstanding reliability performance (e.g. temperature cycling performance) and excellent mechanical resistance. The performance of drop test has been improved by two orders of magnitude compared with that with the use of solder paste.