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Nextool Technology Co.,Ltd

Tongling,  Anhui 
China
http://www.nextooling.com
  • Booth: B2421

An integrated supplier of semiconductor packaging equipment

Overview

NEXTOOL company is an integrated supplier of semiconductor packaging equipment. 

The main products are NTAMS180/NTAMS120 Auto packaging system;  NT-S450A,NT-S250A,NT-S250B series molding press; CSP molding system; provide traditional molding press servo upgrade; softwear upgrade; a variety of Trim&Form&Singulation system and spare parts.

>NEXTOOL listed on Shanghai Sci-Tech innovation board (STAR stock Market) in Nov. 2022, stock code: 688419.

>Awarded the title of "Manufacturing championship of single event "title by Ministry of Industry and Information Technology of China.

>Management system qualified through ISO9001:2008 certification standards.

>With qualification of ”China National High-Tech Enterprise “ and  “Anhui Provincial Technology Center”.

>More than 100 Technical  patents being achieved during 30  years’ experience in research & development .

>CAD/CAM/CAE/ERP/CRM Ⅱ , the world latest computer network systems are introduced in design , manufacturing &  management process.

>The factory covers 60000 square meters, more than 500 employees, key equipment are imported from Switzerland , Germany , Japan and etc.

  Press Releases

  • NEXTOOL was established in 2005 and is an integrated supplier of semiconductor packaging equipment. In 2022, we have listed on the Science and Technology Innovation Board in China Market and the market value is 2.886 billion RMB. Right now NEXTOOL has more than 500 employees.

    NEXTOOL procured high precision machining equipment from Japan, Germany and Switzerland etc., continuously enhancing processing capabilities from a hardware perspective. this ensures the progress and quality of components, thereby improving the stability and reliability of the overall product. In 2018, NEXTOOL obtained the certificate "Manufacturing Industry Single Champion Demonstration Enterprise"  which issued by the Ministry of Industry. 

    NEXTOOL has a strong foreign trade and after-sales service team, with 20 years of global foreign trade experience, customers do not have to worry about the later equipment export, equipment buy-off etc.

  Products

  • Auto Molding System
    For post-process packaging of IC, semiconductor devices and LED substrates. The applicable product packaging forms are: SOP, SOT, SOD, SMA, SMB, DFN, QFN, QFP, BGA, CSP, PLCC, MCM, IGBT, IPM, TO, LED substrates and etc.
    ...

    • Auto molding system includes lead frame alignment unit, strip preheating unit, resin supply unit, feeding manipulator, blanking manipulator, press unit, blanking punching unit and product output colection unit.


    Multi-option function confquration, suitable for customize product needs from different users:.
    · Mobile preheating platform
    · Resin weighing function
    · Visual inspection function
    · Dusting function of concave die
    · Anti-deviation detection function of concave die
    · QR code scanning
    · SECS network communication

  • Auto Trim&Form System
    Automatically loading with complete trimming, forming, singulation process, can achieve bulk bin, tubing and tray offloading methods....

    • Automatic TFS system is modular design structure, easy to combine and expand. Can achieve Automatic laoding, trimming, forming, singulation, horizontal tube loading, tray loading, bulk functions.

    Multi-option function confguration, apply for customize product needs of differenct users:
    · CCD positive and negative detection on product's feeding type
    · CCD detection on joints' cutting and abnormal pin
    · Track, mold destaticizer (ion blowing)
    · Dedicated counting function for mold punching (mold counter)
    · QR code scanning

  • Transfer Molding Press
    For post process packing of lC,semiconductor devices and LED substrates. The main applicable product packing forms are small spacing products like TO, DIP, SOP, SOT, SOD, SMA SMB, QFP, IPM, LED and etc.,...

    • Transfer Molding Press matching with MGP mold and traditional single mold. By using servo oil pump technology to realize high effciency energy saving.

    Multi-option function confguration, suitable for customize product needs from different users:
    · Slow injection function and ultra-slow clamping function module.
    · QR code scanning.
    · Mould protection system.
    · T + TA function.
    · Thimble Oil System.
    · Mould vacuum system.

  • Auto MGP System
    The press is a 450-ton servo plastic sealing press, and a maximum of 16 lead frame products can
    be encapsulated in one mold. The production cycle varies depending on the curing time of the
    product,ranging from 170 to 200 seconds....

    • Automatically complete lead frame arrangement, discharging compound, feeding, package, degate, collection, mold cleaning and product appearance visual inspection and other actions. Apply modular design, different function units can be added according to customize reauirements with servo motor to realize precise drive and control.

    By replacement from manul to machanism application to complete whole work process that reduced labor cost and increased the yield of package products.
    Automatic lead frame arrangement can reduce the damage probability of gold wire and can increase high yield of package products.
    Automatically clean mold surface, improve product quality.
    Automatic visual inspection of product appearance, improve product's quaity stability.
    Automatic degate and collection, reduce labor intensity.

Categories

200 Equipment, Assembly
  • Cut & Down Set; Trim; Form Equipment
  • Deflashing; Degating Tools
  • Molding; Encapsulation; Decapsulation Equipment
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