WinWay Technology (6515), a leading provider of semiconductor test interface solutions, today(Mar.17th) announced its rise as the world's largest semiconductor test socket supplier. In the meantime, WinWay Technology ranks as the second-largest supplier globally when burn-in sockets are included. [Note 1]
According to Yole Group’s Q4 2024 Semiconductor Test Consumables - Burn-in and Test Sockets Market Monitor[Note 2], the global semiconductor test socket market, which includes package testing, system-level testing (SLT), and engineering testing, is projected to grow from USD 1.193 billion in 2024 to USD 1.55 billion in 2029, representing a compound annual growth rate (CAGR) of 5.4%. When the burn-in test market is included, the overall market is expected to grow at a CAGR of 5.2%, increasing from USD 1.608 billion in 2024 to USD 2.074 billion in 2029.
WinWay’s Global Sales & Marketing Division of Senior Vice President, Jason Chen, stated that 2024 marks a pivotal year in the development of generative AI applications. The rapid adoption of AI is driving demand for AI servers and data centers, leading Cloud Service Providers (CSPs) to invest in large language models (LLMs). This is increasing the need for testing large scale package, high-power, and high-frequency/high-speed components.
WinWay has proactively developed and completed its AI and HPC-related product portfolios ahead of industry trend.
WinWay’s revenue from AI and HPC has consistently accounted for more than 50% of the company’s total revenue from 2023 to 2024, positioning company as a high-purity AI supplier. By offering comprehensive AI testing solutions, WinWay continues to be a key enabler in the AI ecosystem. Looking ahead, the company remains committed to expanding AI applications across all product lines.
WinWay continues to introduce innovative testing solutions to meet customer needs. The company has integrated its latest ultra large package, high-frequency, high-speed test socket product, HyperSocket™, with its high-power thermal control product, HEATCon Titan, to create the Liquid Cooling Total Solution. This liquid-cooled test socket ensures active thermal control from top-to-bottom during the testing process. The application of this product line extends from Automated Test Equipment (ATE) to System-Level Testing (SLT). As a leader in semiconductor test interfaces for the AI era, WinWay remains dedicated to driving innovation in testing solutions.
Note 1: This data was released by John West, Chief Analyst for Semiconductor Equipment at Yole Group, during TextConX 2025.
Note 2: Semiconductor Test Consumables – Burn-in and Test Sockets Market Monitor, Q4 2024, Yole Group.