Chung King Enterprise Co.,Ltd

Products Specifications

● Product name：Reticle SMIF Pod(RSP 150)-BKM7
● Part number：RSP-BKM7
● Dimension：226.92(L) x 229.8(W) x 91.6(H)mm
● Weight：1340g
● Capacity：1 PCS
● Mask size：6025 Mask(6 inch)
● Material：PEEK

Products Description

Reticle SMIF Pod(RSP 150)-BKM7, Contamination proof, assure safety of 6” photomask during transfer and storage between station and station.

Products Specifications

● Product name：Panel FOUP / FoPLP FOUP 510x515
● Part number：GL-PF512
● Dimension：600(L) x 620(W) x 438(H)mm
● Weight：≒25000g
● Capacity：12 PCS
● Glass size：510 x 515mm，Thickness 0.4-3.2mm (Glass Panel or PCB)
● Material：Customized
● Slot pitch：25mm

Products Description

Panel FOUP can carry square glass , Glass Panel and PCB carrier board. Panel FOUP for FoPLP (Fan-out Panel Level Process) is used in panel- level fan-out packaging . Panel FOUP carries large-area and ultra-thin carriers. The large-size, multi-layer one-piece customized design significantly reduces process costs. Panel FOUP supports automated transmission (AMHS), import, mechanical opening, assisting the customized needs of emerging technologies and special processes, providing the best automation assistance for heterogeneous integration.

Panel FOUP 510x515 / FoPLP FOUP Features

● One-piece molded design, high strength, thin and light, low resonance, achieving superior air-tight effect.
● Simplified parts, reduce parts loosening and avoid accumulation of dirt, ensure safe and reliable automatic operation.
● Antistatic, low dust generation and wear-resistant. Support is manufactured using a special CFRP construction method and has high load-bearing rigidity.
● Comply with SEMI standard (E181, E181.1~E181.4)
 

Products Specifications

● Product name：CK300 FOUP
● Dimension：415(L) x 335(W) x 337(H)mm
● Capacity：25 PCS / 13PCS
● Apply for round wafer：300mm(12 inch)Wafer
● Material：Customized
● Slot pitch：10 mm / 20mm

Products Description

300mm FOUP, Able to protect, deliver and store 300mm wafer, provide safe protection during delivery and storage. Reduce particle contamination of wafer, protect wafer from static electricity damage and then increase yield rate. 25 slots type uses for general wafer. 13 slots type can store glass carrier and Thin wafer.

CKplas FOUP series of product line fully align with SEMI standard of automation interface, compatible with AMHS. Not only design for standard silicon wafer, but also for special thin wafer application, CK300 FOUP create mini-environment to protect valuable wafer for transfer and storage purpose.

Products Specifications

● Product name：Frame FOUP Plus
● Part number：CKF300 Plus
● Dimension：387.0(L) x 392.0(W) x 196(H)mm
● Capacity：13 PCS
● Apply for round wafer：12 inch (Ø300mm) Wafer
● Material：PC ESD

Products Description

Film Frame FOUP (Dicing) / Tape Frame FOUP Plus in semi-conductor assembling process, it's used to load and fix metal frame with wafer. Anti-static material, lightweight, airtight design are to isolate and protect wafer, which is used to transfer, store and protect assembling wafer for each process.

● Airtight, Anti-static, Light weighted.
● Original equipment applicable, and AMHS applicable. E-rack automated storage.
● Top Flange high-strength materials, and anti-shock and wear resistance.

Products Specifications

● Product name：8" Wafer Shipping Box
● Part number：SH-B200
● Dimension：258.6(L) x 263.8(W) x 263.5(H)mm
● Weight：1600g
● Capacity：25 PCS
● Apply for round wafer：8 inch (Ø200mm)
● Material：PP
● Slot pitch：6.35mm

Products Description

Wafer Shipping Box has and bottomupper lid lid, use to deliver blank wafer from ingot to wafer factory, avoid wafer collision and contamination, not able to enter process. Stackable, dispatch after cleanliness.

Products Specifications

● Product name：8" PEEK Cassette
● Part number：PK-C200
● Dimension：233.2(L) x 201.5(W) x 221.4(H)mm
● Weight：910g
● Capacity：25 PCS
● Apply for round wafer：8 inch (Ø200mm)
● Material：PEEK ESD
● Slot pitch：6.35mm

Products Description

● High hardness, not easy to distort, high temperature resistant
● Use to transfer inside factory
● Able to go with airtight Storage Box to protect wafer
● Able to do laser engraving、Able to install RFID. Keep the track of carrier and material.

Also available in a wide range of materials, including PP, PC, PEI, PFA, and metal options, to meet diverse semiconductor process requirements.