Component Technology Pte., Ltd.

Singapore, 
Singapore
  • Booth: L801
  • - 4th Floor

Component Technology Pte Ltd was incorporated on 11 November 1989. Our business is mainly with the electronic industries, especially in the Semiconductor Backend.

We have received a number of awards from our principal suppliers, such as: “Worldwide Top Performer”, “Representative of the Year”, etc. We have established stable cooperation and relationship with leading automotive and high end electronics semiconductor manufacturers through leverage on Technology, Quality, Cost, Services and Delivery.



Our market includes Singapore, Malaysia, Thailand, Philippines, China, South Korea and Japan. We have established dedicated service support in these countries. Our products includes Vision Inspection and Measurement machines for wafer, leadframe, die and wire bond; Die Bonder; SMT Handlers.


 Products

  • IV-1000E
    Automated Die and Wire Bond Inspection System. The first back-end semiconductor solution to increase productivity....

    • A FULLY AUTOMATED 2D/3D INSPECTION SYSTEM, IV-1000E OFFERS ITS USER A HASSLE FREE AUTO-CONVERSION PACKAGE CHANGE. THE CHANGING OF DIFFERENT REJECT MODULE WAS ALSO MADE EASY WITH OUR QUICK CHANGEOVER KIT.


    OUR SELF-DEVELOPED SOFTWARE ENABLES USERS TO CONTROL AND ADJUST THE TRACK WIDTHS OF BOTH THE MAGAZINE HANDLERS AND INDEXER.


    WITH OUR INSPECTION DATA INCORPORATED INTO THE SPC QUALITY CONTROL METHODS, IT WILL ENSURE THE PROCESS TO OPERATE AT ITS FULLEST POTENTIAL.

  • IV-W2000
    The Model IV-W2000 is specially designed for backend packaging wafer inspection to handle sawn, un-sawn, region of wafer and expanded wafer....

    • THE MODEL IV-W2000 IS SPECIALLY DESIGNED FOR BACKEND PACKAGING WAFER INSPECTION TO HANDLE SAWN, UN-SAWN, REGION OF WAFER AND EXPANDED WAFER.

Categories

202 Equipment, General Use
  • Vision; ID; Bar Code Systems
    • 203 Equipment, Inspection & Measurement
  • Defect; Particle; Bump; Contamination Detection, Review or Inspection
  • Die Inspection; Die Shear
  • Wafer; Substrate Metrology; Topology; Nanotopography; Flatness Measurement; Crystalline Orientation
  • Wire Bonding Inspection; Test
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