Hesse Asia Limited

The Bondjet models BJ955 and BJ959 from Hesse GmbH have set new benchmarks of speed, precision and low maintenance needs for the bonding process, due to the use of gantry kinematics with linear motors on the machines. Together with the enlarged working area of up to 350 mm x 500 mm, these two renovated models boast the capability to fulfill the current and future demands on the bonding requirements of the industry.

The models have on average 30% more yield than their predecessors.

The models have some advanced features as below:
- the weightless bondhead with integrated non-destructive pull-tests;
- the active cutting system;
- E-Box (an optical system assisting the set-up of cutter, wire guide and wedge tool) and;
- PiQC, the process integrated quality control system (for non-destructive quality tests and individual bond monitoring).

Both models can manage heavy aluminum and copper wires (up to 500 um) as well as ribbons for a high current (i.e. High Current Ribbon, HCRtm...).

The Bondjet BJ855 is the latest generation of fully automated fine wire bonders and expands the existing product portfolio of fine wire bonders. The Bondjet BJ855 is characterized by the following features:
■ Wedge-wedge and ball-wedge bondheads
■ Optimized pattern recognition (PR)
■ Sofware features for the growing demand of connectivity and
industry 4.0 (e.g. Hesse Bonder Network, remote control of PR,
improved MES integration, ...)
■ Hesse Assist Tools: load cell, bondtool and wire spool detection,
bondtool calibration without wedge gauge for operator independency.

The Bondjet BJ855 is ready for all wire bonding challenges on a single platform, using wires and ribbons of all common materials. 

Typical applications are components in RF technology, COB, MCM, hybrids, optical and automotive electronics.

In addition to a standard configuration, Hesse offers automation concepts individually adapted for every application.

BJ931, the heavy wire model, is specifically designed for handling power leadframe applications, from the simplest, like TO200/TO220PF, to the more complex, like matrix D-Pak/DFN with equal ease.

Advanced features of the machines:
- bondhead-integrated non-destructive pull tests;
- high speed;
- large bonding area;
- active cutter;
- E-box (an optical system assisting the set-up of cutter, wire guide and wedge tool) and;
- PiQC, the process integrated quality control system (for non-destructive quality tests and individual bond monitoring).

These features on BJ931 and Hesse's enhanced quality control systems are customized to suit your specific requirements and achieve high productivity.

BJ820 is meant for high-volume production environments, with advantages as follows:

- the very high axis precision of 1μm;

- large bond area of 305mm x 410mm;

- ultra-fine bond-pad pitch capability at 40um inline;

- large effective Z-axis travel of up to 30mm;

- the powerful PiQC system (Process integrated Quality Control, for real-time bond quality monitor by the deformation sensor and transducer current) and;

- the nearly wear-and-maintenance-free Piezo bondhead, altogether enable its suitability for high-volume production.

Bondjet BJ820, the 3rd generation of Hesse GmbH's thin-wire model, is an innovation in the thin-wire wedge bonding market and a valuable alternative to ball-bonding and other processes. All challenging wire bonding applications can be handled on this single platform – RF, microwave devices, COB, MCM, hybrids, fiber optics and automotive using aluminum or gold wires or ribbons.