Indium Corporation

Singapore, 
Singapore
  • Booth: J2240
  • - 1st Floor

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.



 Press Releases

  • Indium Corporation will feature its Flip-Chip Flux WS-446HF and Ball Attach Flux
    WS-823 at SEMICON Taiwan 2018 Sept. 5-7 in Taipei, Taiwan.

    Indium Corporation’s WS-446HF is a water-soluble, halogen-free flip-chip dipping flux with an activator system powerful enough to promote wetting on the most demanding surfaces; from solder-on-pad (SoP) to standard and embedded trace substrates (ETS) and flip-chip on leadframe applications. WS-446HF provides uniform dipping performance over extended periods of time. It also exhibits tackiness that is suitable for holding large die in place during assembly.

    WS-823 is a water-soluble, halogen-free ball-attach flux designed for use in pin transfer and printing applications for ball attachment to substrates (BGA manufacturing). WS-823 has an activator system powerful enough to promote wetting on the most demanding substrate metallizations, such as copper OSP. WS-823 is cleanable with just DI water only.

    From water-soluble and ultra-low/near-zero residue no-clean flip-chip fluxes to system-in-package (SiP) water-soluble and no-clean solder pastes, Indium Corporation has an industry-proven portfolio of products that meet the current and evolving challenges encountered in fine-pitch SiP and Heterogeneous Integration applications.

    For more information on Indium Corporation’s materials for SiP, visit www.indium.com/SiP or visit Indium Corporation’s booth J2240.

    For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.


 Products

  • Indium3.2HF Solder Paste for Fine Feature Printing
    Indium Corporation’s Indium3.2HF is a water-soluble solder paste specifically formulated for fine feature printing applications (Type 6SG). Indium3.2HF is formulated to offer consistent, repeatable printing performance combined with a long stencil life. ...

  • Indium Corporation’s Indium3.2HF is a water-soluble solder paste specifically formulated for fine feature printing applications (Type 6SG).

    Indium3.2HF is formulated to offer consistent, repeatable printing performance combined with a long stencil life. In addition, Indium3.2HF delivers:

    • Good response-to-pause
    • Wide reflow profile window
    • Outstanding slump resistance
    • Excellent wetting capability
    • Superior fine-pitch soldering ability
For Technical Support with this webpage, please contact support.