Innovation Association of Wide Bandgap Semiconductor Technology

Beijing,  Beijing 
China
http://www.iawbs.com
  • Booth: I2700
  • - 1st Floor


I2700 is a Co-exhibition area of the IAWBS.

There are 7 companies in I2700.



​Innovation Association of Wide Bandgap Semiconductor Technology is a national non-profit-making social organization legally registered by the Beijing Municipal Social Organization Registration and Administration Authority, which is a voluntary joint venture of the enterprises of wide bandgap semiconductor R&D, production and application, colleges and universities and Research institutes, etc.



official website:www.iawbs.com



Zhuhai DT Wafer-Tech Co.,LTD is a high-tech company which located in Guangdong Zhuhai High-tech Industrial Zone Jinding Industrial Park. And is committed to the domestic manufacture of III - V compound semiconductor single crystal material based on indium phosphide (InP).



official website:www.dtwafer.com



Beijing Ju Rui Zhong Bang Technology Co., Ltd. is a State-level high-tech enterprises with the background of the Chinese Academy of Sciences, professional engaged in laboratory sharing and knowledge achievements transformation. "Mige laboratory" is the brand owned by the company.



official website:www.labideas.cn



Suzhou HRT Electronic Equipment Technology Co., Ltd. was invested in June 2010. It is a high-tech enterprise mainly engaged in the research and development, production and sales of cutting, grinding, polishing and other special equipment. At present, the company has obtained 33 patents of cutting type, 25 patents of grinding and polishing type, and 4 software copyrights.



official website: www.heruite.com



Cisri-Zhongke Energy Conservation and Technology Co., Ltd. was established in 2015, and is a mixed ownership subsidiary of China Iron&Steel Research Institute Group. The main business of Cisri-Zhongke is supply of new materials technology and equipment, including silicon carbide, sapphire, cemented carbide, etc.



Official website: www.czect.cn



China Science Crystal Technology Co., Ltd. is the designated agent of Japan's Fujibo, Fujimi, RASA, Yasunaga brands in China.The main products are: inorganic materials such as high-purity red phosphorus, gallium, indium, boron oxide, etc.; wafer polishing consumables such as polishing cloth & polishing liquid; wafer cutting machine.



Official website: www.cscrystal.cn





 Products

  • 碳化硅晶片——北京天科合达半导体股份有限公司
    公司的产品主要包括:2~4英寸碳化硅晶片(2~6Inch SiC Substrates)、碳化硅单晶生长设备(SiC Single Crystal Growth Equipment)、碳化硅晶体切割、晶片加工及清洗返抛服务(Ingot Processing&Wafer Surface Processing Service)、碳化硅宝石晶体(SiC Moissanite Crystals)等业务;拥有碳化硅单晶生长、晶体及晶片加工和晶片清洗检测的关键技术。...

  • 产品服务(Profucts&Services):

    1.公司生产2~6英寸碳化硅晶片,其中典型的有4H导电晶片、6H导电晶片和4H半绝缘晶片。

    We produce 2~6 inch SiC substrates, and 4H N-type, 6H N-type and 4H Semi-insulating are our typical products.

    2.公司自主研发设计的碳化硅单晶生长设备,可用于4到6英寸导电及半绝缘型碳化硅单晶的生长制备。采用单室立式双层水冷不锈钢结构,由炉膛、真空获得及测量系统、坩埚杆拉送系统、感应加热系统、电控系统、中频电源等组成。可根据客户对单晶生长设备特殊要求进行产品定制,并提供基础碳化硅单晶生长技术支持。

    Self-developed single crystal growth system which can be used for the preparation of 4-6 inch conductive and semi-insulating silicon carbide single crystals.

    Be composed of stainless steel single chamber furnace which has double layer water-cooling system, vacuum system, crucible pulling system, induction heating system, electric control system, intermediate frequency power supply, etc.

    Can be customized and could provide the basic silicon carbide crystal growth technology support.

    3.完整的碳化硅加工生产线, 可以提供从碳化硅晶体切割、晶片研磨、抛光、CMP到清洗检测,以及外延片的清洗返抛等服务。

    Provied services for SiC ingot slicing, wafer lapping, CMP and cleaning, as well as the reclaim of epitaxial wafers.

    4.碳化硅宝石晶体(SiC Moissanite Crystals)

    关键技术(Key Technologies):

    1.碳化硅单晶生长:

    掌握了一系列获得高品质碳化硅单晶产品的关键技术,如获得碳化硅晶体生长区的最佳温度和温度梯度的方法及其精确控制和调节,载气量和气压的稳定保持,以及籽晶和原料的特殊处理。

    Self-developed a series of key technologies to obtain high quality silicon carbide single crystals: such as the achieving and precisely control of the appropriate crystal growth zone temperature and temperature gradient, maintenance of carrier gas flow and pressure, as well as special treatment to seed wafers and raw materials.

    2.碳化硅晶体及晶片加工关键工艺技术:

    通过选取合适的磨料以及采用适当的加工设备和加工工艺,对碳化硅晶体以及晶片进行切割、研磨、抛光和CMP加工,获得高表面质量和平整度的碳化硅晶片,适用于外延和器件客户使用。

    Self-developed key technologies for silicon carbide ingot&wafer processing: select the appropriate abrasive materials and appropriate processing recipe to slice, grind, polish and CMP silicon carbide ingot&wafer, obtained good flatness and surface quality silicon carbide wafers which are applicable for the use of epitaxial and device customers.

    3.碳化硅晶片清洗检测工艺技术:

    开发出碳化硅晶片表面处理、清洗、封装等工艺技术,使产品达到开盒即用。建立了系统的碳化硅晶体、晶片检测方法和检测标准,确保产品质量满足工业客户要求。

    Self-developed silicon carbide wafer surface treatment, cleaning and packaging technologies so that the wafers are in epi-ready condition. Established strict inspection methods and test standards to guarantee the quality of products.

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