Jipal Corporation

Hsin Chu, 
Taiwan
  • Booth: L116
  • - 4th Floor

Welcome to Jipal booth L 116 (4F) !!!

JIPAL CORPORATION is a professional agent for Semiconductor Packaging and Testing / LED/Solar/ SMT equipment and materials and providing after -sales and technical service support.



Products:



Allteq:Die Coater & Post W/B Inspection.



Aurigin:Advanced Solder Ball Placement.



Asahi: Auto Transfer Molding System,



Alpha:Flux, Solder Paste & Sphere. 



Capable: Professional Mold Chase / kit.



Furukawa:UV Tape for Dicing, Grinding & BGA Singulation, Die Attach flim Adhesives DAF &FOW.



Fasford:LOC/BOC Die Bonder.



GSP: Fully Auto Jig Saw Singulation System. 



Hitachi (Tohken) : X-ray Inspection System.



Hitachi (Aimechatec) : Ball Printing System.



Hover-Davis: The feeder expert, Tape & Reel Feeder, Label Feeder.



IKK: New Module Trim/Form System.



JHT:Pick & Place Test Handler.



KLA-Tencor: Wafer Inspection, Component Defect Inspection. 



Kinergy:QFN buffing Machine.



MKE: Bonding Wire. 



Okamoto:Wafer Back Grinder & Polisher. 



Orion : High Throught-put TCB Bonder. 



PAL:Ni/Au copper plating line for BGA Substrate.



Teikoku:Wafer Mounter & Taper/Detaper.



UBCT: Factory Automation Solution Provider.



    


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