Kulicke & Soffa Industries Inc.

  • Booth: M540
  • - 4th Floor

Welcome to visit K&S

Kulicke & Soffa (NASDAQ: KLIC) is a leading provider of semiconductor packaging and electronic assembly solutions supporting the global automotive, consumer, communications, computing and industrial segments. As a pioneer in the semiconductor space, K&S has provided customers with market leading packaging solutions for decades. In recent years, K&S has expanded its product offerings through strategic acquisitions and organic development, adding advanced packaging, electronics assembly, wedge bonding and a broader range of expendable tools to its core offerings. Combined with its extensive expertise in process technology and focus on development, K&S is well positioned to help customers meet the challenges of packaging and assembling the next-generation of electronic devices. (www.kns.com)


  • Asterion EV

  • The Asterion™ EV (Extended Version) wedge bonder is built on a reengineered architecture that includes an expanded bond area, new robust pattern recognition capabilities and extremely tight process controls. Together these deliver heightened productivity, bonding quality, and reliability. The enlarged bondable area enhances flexibility and reduces line integration costs. Asterion is driven by a precise new direct-drive motion system that requires minimum maintenance and delivers high repeatability. The graphical editor, multi-segment bonding, global parameter change, and a library of new software features, make programming and optimizing bonding process of complex devices relatively easier.

  • ConnX Elite

  • ConnX ELITE™ is the latest high speed automatic wire bonder in the industry leading Power Series. Updated motion control systems and the Quick Suite processes deliver maximum productivity and simplified process optimization. ConnX ELITE is the new standard in interconnection for Discrete and Low Pin Count packages.
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