Finetech GmbH & Co. KG

  • Booth: J2446
  • - 1st Floor

From its modest apartment start-up days in 1992, Finetech has grown to become a leading, global supplier of placement, assembly and rework equipment for customers involved in microelectronics.

Finetech’s high‐accuracy bonding equipment for micro assembly supports the most precise and complex applications.  Sub-micron placement is possible with an extensive range of bonding technologies; our quality optics and highly stable machine design provide the accuracy and repeatability that today’s applications demand. Our professional SMD hot gas rework systemsprovide high end solutions. These products deliver the key benefits needed for reworking advanced devices.

The entire product development and production chain is accomplished internally (machine hardware, process modules, control electronics, tooling, software and more). This approach allows for short response times and high effectiveness at every step.


  • Fineplacer Pico RS
    Modular Hot Air SMD Rework Station FINEPLACER® pico rs is an enhanced hot air rework station for assembly and rework of all types of SMD components....

  • he system is a bestseller for professional mobile device rework in high density environments. A high level of process modularity allows all rework process steps within one system. The FINEPLACER® pico rs system is at home in R&D, process development, prototyping and production environments.

    Application area from 01005 up to large BGA on small to medium sized PCBs, with the goal to have highly reproducible soldering results.


    • Industry-leading thermal management
    • High efficiency board heater
    • Closed loop force control
    • Automated top heater calibration
  • Fineplacer Femto 2
    Prototype2Production Bonder The FINEPLACER® femto 2 is a fully-automated die bonder with a placement accuracy of 0.5 µm @ 3 sigma. ...

  • A complete machine enclosure allows very demanding applications in a controlled environment. Fully protected from external influences, the system stands for highly stable assembly processes with the focus on maximum yield.

    The new generation of the femto platform adds numerous innovations to the proven technical basis. This includes the cutting-edge FPXvisionTM. Combined with a refined pattern recognition, this all-new Vision Alignment System opens up a new dimension of application flexibility and accuracy. IPM Command, the fully revamped FINEPLACER® operating software, supports a consistent, ergonomic and clearly structured process development.

    Depending on the requirements, the modular FINEPLACER® femto 2 can be individually configured and retrofitted at any time to support new applications and technologies. This makes the system a perfect tool and reliable companion as applications migrate from product development to production. It covers the entire workflow of inspection, characterization, packaging, final test and qualification in semiconductor, communications, medical and sensor technologies.


    • Placement accuracy 0.5 μm @ 3 sigma
    • Fully-automated operation
    • Manual operating routines available
    • Safe and controlled process environment with cleanroom quality
    • Full process traceability and protocol function
    • Full process access and easy programming
    • FPXvisionTM: max. resolution across large field of view
    • Ergonomic operating concept with touch screen interface
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