Hesse Asia Limited

Kwun Tong, 
Hong Kong
  • Booth: M958
  • - 4th Floor

Welcome to Hesse Mechatronics at Booth M958!

Click to view our exclusive Invitation Letter and download the event floor plan at  https://u.eqxiu.com/s/VOLHDl5L?eqrcode=1

Hesse GmbH, founded in 1978, is a German equipment manufacturer delivering high-end semiconductor assembly equipment. Our products include automatic thin- and heavy-wire wedge bonders and ultrasonic flipchip bonders.

Thin Wire Bonder

Bondjet BJ855, designed for challenging applications like 40um ultra-fine pitch with real-time quality control, is featured with a huge bond area and a wear-free bondhead. It delivers rapid bonding speed up to 7+ wires/second for optimal process flexibility and productivity.

Heavy Wire Bonder

Bondjet BJ955/959 single-head and BJ931 dual-head are capable of bonding 100-500 µm Al and Cu wires/power ribbons for applications like power modules, IGBT, automotive devices, CPV panels and RF amplifiers, etc. These machines are equipped with bondhead integrated pull testers, active wire cutter, E-Box (bondhead set-up visual aid), anti-vibration system, and the powerful patented PiQC real-time quality control system as well.

More to come

Other products' information, more detailed explanations and demonstrations are available on-site with our professional service engineers standing by to help. Welcome to visit us at #M958!


    Power modules, IGBT, EV battery applications; Increased productivity; Enlarged work platform; Speedy and precise; Low maintenance needs; Copper wire capability...

  • The Bondjet models BJ955 and BJ959 from Hesse GmbH have set new benchmarks of speedprecision and low maintenance needs for the bonding process, due to the use of gantry kinematics with linear motors on the machines. Together with the enlarged working area of up to 350 mm x 500 mm, these two renovated models boast the capability to fulfill the current and future demands on the bonding requirements of the industry.

    The models have on average 30% more yield than their predecessors.

    The models have some advanced features as below:
    - the weightless bondhead with integrated non-destructive pull-tests;
    - the active cutting system;
    - E-Box (an optical system assisting the set-up of cutter, wire guide and wedge tool) and;
    - PiQC, the process integrated quality control system (for non-destructive quality tests and individual bond monitoring).

    Both models can manage heavy aluminum and copper wires (up to 500 um) as well as ribbons for a high current (i.e. High Current Ribbon, HCRtm...).

    Fastest bonding speed in the industry; Largest working area; Greatest axis accuracy...

  • The Bondjet BJ855 is the latest generation of fully automated fine wire bonders and expands the existing product portfolio of fine wire bonders. The Bondjet BJ855 is characterized by the following features:
    ■ Wedge-wedge and ball-wedge bondheads
    ■ Optimized pattern recognition (PR)
    ■ Sofware features for the growing demand of connectivity and
    industry 4.0 (e.g. Hesse Bonder Network, remote control of PR,
    improved MES integration, ...)
    ■ Hesse Assist Tools: load cell, bondtool and wire spool detection,
    bondtool calibration without wedge gauge for operator independency.

    The Bondjet BJ855 is ready for all wire bonding challenges on a single platform, using wires and ribbons of all common materials. 

    Typical applications are components in RF technology, COB, MCM, hybrids, optical and automotive electronics.

    In addition to a standard configuration, Hesse offers automation concepts individually adapted for every application.

    Heavy-wire power leadframe package assembly; Specialized leadframe indexing system for power leadframes,eg. TO220, D-Pak and DFN in high productivity...

  • BJ931, the heavy wire model, is specifically designed for handling power leadframe applications, from the simplest, like TO200/TO220PF, to the more complex, like matrix D-Pak/DFN with equal ease.

    Advanced features of the machines:
    - bondhead-integrated non-destructive pull tests;
    - high speed;
    - large bonding area;
    - active cutter;
    - E-box (an optical system assisting the set-up of cutter, wire guide and wedge tool) and;
    - PiQC, the process integrated quality control system (for non-destructive quality tests and individual bond monitoring).

    These features on BJ931 and Hesse's enhanced quality control systems are customized to suit your specific requirements and achieve high productivity.

    Best-seller; Valuable alternative to ball-bonding; 1μm repeatability; 40μm ultra-fine bond pad pitch; Optimized in large-scale production...

  • BJ820 is meant for high-volume production environments, with advantages as follows:

    - the very high axis precision of 1μm;

    - large bond area of 305mm x 410mm;

    - ultra-fine bond-pad pitch capability at 40um inline;

    - large effective Z-axis travel of up to 30mm;

    - the powerful PiQC system (Process integrated Quality Control, for real-time bond quality monitor by the deformation sensor and transducer current) and;

    - the nearly wear-and-maintenance-free Piezo bondhead, altogether enable its suitability for high-volume production.

    Bondjet BJ820, the 3rd generation of Hesse GmbH's thin-wire model, is an innovation in the thin-wire wedge bonding market and a valuable alternative to ball-bonding and other processes. All challenging wire bonding applications can be handled on this single platform – RF, microwave devices, COB, MCM, hybrids, fiber optics and automotive using aluminum or gold wires or ribbons.

For Technical Support with this webpage, please contact support.