Meyer Burger (Netherlands) B.V.

  • Booth: J2546
  • - 1st Floor


Meyer Burger is a leading global technology company specializing on innovative systems and processes based on semiconductor technologies. The company’s focus is on photovoltaics (solar industry) while its portfolio has evolved from the technologies which have been successfully implemented in the PV market to cover a broad range of applications in other markets, such as semiconductor, printed and hybrid electronics, PCB, OLED, life science, and high precision optics. Meyer Burger enables customers to reach the lowest manufacturing and production costs in their industry by delivering customized equipment solutions and integrated systems.

At its location in Eindhoven, Netherlands, the focus is on the design and manufacturing of PiXDRO functional inkjet printing and FLEx thin film coating equipment.

The company’s comprehensive product portfolio is complemented by a worldwide service network with spare parts, consumables, process know-how, customer support, after-sales services, training and other services. Meyer Burger is represented in Europe, Asia and North America and has subsidiaries and own service centres in China, Germany, India, Japan, Korea, Malaysia, the Netherlands, Switzerland, Singapore, Taiwan and the USA. The company is also working intensively to develop new markets such as South America, Africa and the Arab region.


  • PiXDRO LP50 Inkjet Printer
    The PiXDRO LP50 is a desktop R&D inkjet printer for functional printing applications. It is designed for development of inkjet processes and applications, such as semiconductor packaging, PCB, printed electronics, photo voltaic, display and bio-medical....

  • The PiXDRO LP50 is a desktop R&D inkjet printer for functional printing applications. It is designed for research and development of inkjet processes and applications, as well as evaluation and development of inkjet materials.

    The LP50 platform is an open, accurate, flexible and easy to use system that will allow you to work at the frontiers of inkjet printing technology. The LP50 is designed for a wide range of applications such as semiconductor packaging, PCB, printed electronics, photo voltaic, display and bio-medical.

    Main advantages

    • High precision inkjet printing
    • Advanced metrology options
    • Open and intuitive HMI architecture
    • Fast exchange of printheads and inks
    • Automated printhead maintenance

    Key features

    • Compatible with solvent-based, aqueous, hotmelt and UV-curable inks
    • Vision systems for drop inspection, substrate alignment and print inspection
    • Accurate 5-axis motion systems
    • Substrate chuck heating
    • All industrial components

    Choice of industrial printheads

    • Fujifilm Dimatix S-class, Sapphire, Emerald, Samba G3L, DMC
    • Konica Minolta KM512, KM1024i
    • Xaar 1003 series
    • Océ CrystalPoint C29

    Options and enhancements

    • Advanced Drop Analysis (ADA) for best ink jetting performance
    • Automatic Print Optimization (APO) for best application results
    • Substrate chuck cooling
    • Dual printhead configuration
    • Ink tank heating
    • UV LED pinning and curing
    • Laser source module
    • Customized substrate holders
    • Glovebox integration for inert environment
    • JS20 printhead storage station
    • Printer table with storage cabinet and monitor/keyboard swing arm
    • Recirculating ink supply for nanoparticle inks
    • Advanced Gerber file rasterizer
  • MAiA
    The modular inline system for various plasma coating and etching processes...

  • MAiA® - Multiple application inline apparatus

    Industrially proven large-area, high throughput PECVD equipment platform

    Plasma experience for more than 30 years with over 800 systems installed base in photovoltaics

    Modular platform system for high fl exibility in throughput and technology

    Multiple process steps in one equipment without vacuum breakage

    Substrate widths up to 1,000 mm

    RF-biased enhanced PECVD at T < 100 °C

    High deposition rates > 2.0 nm/s

    Robust hardness ~15 GPa

    Low absorption ε < 0.002 @ 400 nm

    Low film stress +100 to -250 MPa for 2 μm

    Good grafting with peel strenghts > 1 N/cm2

    High breakdown voltage in salty water 20 V/μm

    Anti-reflective coatings with SiNx & SiOx

    High variability of refractive index of SiNx fi lms (up to 2.2)

    Low absorption ε < 0.001 @ 400 nm

    Hardness of up to 16 GPa for doped SiNX

    Low film stress +100 to -250 MPa

    Flat and curved substrates

    Microwave plasma etching

    Well-defi ned etch depth for typical layer thicknesses 50 - 3,000 nm

    Excellent non-uniformities ≤ 3% for processes with high etching rates

    up to 400 nm/min

    Minimizing stress on sample

    Materials: Nitrides, Oxides, Silicon, and Carbon-based Graphit

    Process gases: Fluorine-based, Chlorine-based, and Others

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