Sentec Group USA

Taoyuan County, 
  • Booth: K2023
  • - 1st Floor

Sentec Electro Ceramic & Device Group offers various substrate and IC packaging solutions.

Process Technologies were transferred from Panasonic since year 1999.

Main Product:

‧High Accuracy Multi-Layer LTCC Substrate (X,Y ±0.05%) ex. Interposer/MLC

‧Direct Plating Copper Metallization on Al2O3 & AlN Substrate

‧Hermetic Ceramic Package (QFN, Substrate & CSP)

‧Turnkey Packaging Service (CSP, COB, MCM or SiP)


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