Scientech Corporation

Hsinchu City, 
Taiwan
  • Booth: M0248
  • - 4th Floor

Scientech is a leading supplier for Equipment and Wafer Reclaim Service for Semiconductor and FPD industries.

Scientech’s market coverage includes SEMI Front-End, Advanced Packaging, TSV/3D Interconnect, Compound SEMI, MEMS, LED, OLED, Flat Panel Display, Touch Panel, PV and Analytical Instruments.

Established in 1979 as a representative for semiconductor industry, Scientech expanded its business into Wet Process Equipment, Temporary Wafer Bonding/De-Bonding Equipment and 300mm Wafer Reclaim Services.

To provide the best quality of services to customers, Scientech sets up 16 offices across the globe. Scientech is ISO certificated across all product lines, and a listed company in Taiwan stock exchange market.

Wherever the customers are, where we are.


 Press Releases

  • (20190813)

 Products

  • 4” & 6” SiC Wafer Reclaim
    Scientech is not only a leading supplier of 300mm wafer reclaim service, but also 4” & 6” SiC wafer reclaim. Our output capacity is 3000pcs/M (4” equivalent)....

  • Scientech provides 4” & 6” SiC wafer reclaim service by professional reclaim technique, new equipment/ utility and advanced process technology for high quality SiC substrates.

    Process Capability

    • Grinding

            - Surface roughness, Ra: ~1nm

            - TTV: < 3um

    •  Polishing

            - Surface roughness, Ra: ~1A

    •  Cleaning

            - Surface cleanness, LPD <0.3um

            - Surface Metal < 1E10 Atoms/cm2 (By ICP-MS)

    •  Inspection(Geometry/ Defect)

            - FRT/ Candela

  • 12” Wafer Reclaim & 12” Test Wafer
    Scientech is a leading supplier of 300mm wafer reclaim service and 300 mm test wafer. Our output capacity is 120k/M for completely separated Cu and Non-Cu wafer reclaim process. For more detail, please refer to http://www.scientech.com.tw....

  • Scientech provides 12” wafer reclaim service and 12” test wafer.  Our team is formed by professional reclaim technique, new equipment/ utility and advanced process technology for 20/16 nm IC design rules.  Our customers are covered in major Logic, DRAM Fab, equipment, and research lab worldwide. 

    Our Mission:

    •  Minimum Removal Rate
    •  Maximum Return Rate
    •  Minimum Return Time
    •  Robust Quality System
    •  Accurate Tracing System
    •  Quick Respond System
     
  • Genmark and Kensington robot repair center
    Scientech establishes a repair center for Genmark and Kensington automation product....

  • Scientech provides the Overhaul and repair, spare parts and customer side service for Genmark and Kensington automation product.

    Genmark type:

    • GB8SM & GB8Y
      UltraTech (UT) / ClassOne /EVG…… used robot
    • GB7 & GB7S & GB7SY
      EVG /SUSS/NEXX/PSK ……. used robot
    • GB4 / GB4S/ GB4P
    • Pre-aligner
    • Controller
    • Loadport  Porta 300 / Porta 300 plus
    • EFEM system

    Kensington type:

    • WFH4D
      Nanometric / ADE ……used robot  
    • Standard ML series robot
      AMAT Produce ……
  • Wet Process Equipment - Sirius
    “Sirius” equipment is latest developed soak-n-spray technology by using single wafer process platform. Details please refer to http://www.scientech.com.tw for the products we represent and we design/manufacture....

  • 2002年,辛耘企業投入批次式及單晶片式濕製程設備研發製造,已經獲得國內外客戶採用與肯定。目前辛耘擁有 5,000㎡ 生產製造廠房,還擁有 Class 10 等級無塵室服務客戶製程驗證。產品包含手動 / 半自動 / 全自動的批次式及單晶片製程設備提供客戶2”~12”製程應用需求。特有的 cassette type / boat type / cassette-less tye 技術提供半導體晶圓、藍寶石、玻璃、太陽能晶圓、薄化晶圓等等..的應用。此外,專利產品Advantech Dry 提供客戶各種關鍵乾燥的製程應用。

    新開發Sirius系列設備,結合批次式及單晶片式濕製程優點並擁有特殊垂直高壓噴洗技術提供製程彈性。應用領域含括:

    Sirius Series濕製程設備:

    • Front-end semiconductor
    • Back-end semiconductor
    • MEMS微機電
    • GaAs 砷化鎵
    • LED
    • Solar Cell
    • 製程應用如下
      • 金屬掀離
      • 清洗
      • 蝕刻
      • 酸洗
      • 鹼洗
      • Solvent
      • 黃光顯影、去光阻
      • 去蠟

          我們的特色:

    • 客製化軟硬體設計服務
    • 專業與快速的售後服務
    • 安全設計兼具簡易操作
    • 主動協助客戶快速量產
  • Temporary Bonding/De-bonding System
    Scientech is a leading supplier for Temporary Bonding System which include Temporary Bonding , De-bonding, Release Layer Formation and Carrier Recycling.<br />Please refer to http://www.scientech.com.tw for the products we represent and we design/manufacture.<br />...

  • 2015年,辛耘企業投入暫時性貼合設備研發製造,已經獲得國內外客戶採用與肯定。目前辛耘擁有 5,000㎡ 生產製造廠房,還擁有 Class 10 等級無塵室服務客戶製程驗證。產品包含手動 / 半自動 / 全自動的暫時性貼合、剝離、解離層成型及載具回收系統提供客戶4”~12”製程應用需求。

    暫時性貼合設備:

    • front-end Semiconductor
    • Back-end Semiconductor, include 3D,TSV,Bumping and Fan-out
    • Power Device / IGBT
    • MEMS微機電
    • GaAs 砷化鎵
    • LED
    • 製程應用如下
      • Temporary Bonding
      • De-Bonding
      • Carrier Recycling
      • Release Layer Formation

        我們的特色:

    • 客製化軟硬體設計服務
    • 專業與快速的售後服務
    • 安全設計兼具簡易操作
    • 主動協助客戶快速量產
  • Wet Process Equipment
    Scientech is a leading supplier for Wet Process Equipments which include Wet Bench and Single Wafer Wet Process Tools.<br />Please refer to http://www.scientech.com.tw for the products we represent and we design/manufacture.<br />...

  • 2002年,辛耘企業投入批次式及單晶片式濕製程設備研發製造,已經獲得國內外客戶採用與肯定。目前辛耘擁有 5,000㎡ 生產製造廠房,還擁有 Class 10 等級無塵室服務客戶製程驗證。產品包含手動 / 半自動 / 全自動的批次式及單晶片製程設備提供客戶2”~12”製程應用需求。特有的 cassette type / boat type /e cassette-less type 技術提供半導體晶圓、藍寶石、玻璃、太陽能晶圓、薄化晶圓等等..的應用。此外,專利產品Advantech Dry 提供客戶各種關鍵乾燥的製程應用。應用領域含括:

       Polar Series Single Wafer單晶片式濕製程設備:

    • BEoL Semiconductor and Packaging
    • 製程應用如下
      • 蝕刻
      • 清洗
      • 去光阻
      • 金屬掀離

     WSE Wet Bench批次式濕製程設備:

    • Front-end semiconductor
    • Back-end semiconductor
    • MEMS微機電
    • GaAs 砷化鎵
    • LED
    • Solar Cell
    • 製程應用如下
      • 清洗
      • 蝕刻
      • 酸洗
      • 鹼洗
      • Solvent
      • 黃光顯影、去光阻
      • 250℃/300℃高溫
      • 去蠟
      • KOH蝕刻
      • 化鍍
      • Dryer

        我們的特色:

    • 客製化軟硬體設計服務
    • 專業與快速的售後服務
    • 安全設計兼具簡易操作
    • 主動協助客戶快速量產

Categories