Test Research, Inc. (TRI)

  • Booth: J3042
  • - 1st Floor

Your test and inspection partner. Visit us at booth #J3042.

Test Research, Inc. (TRI) offers a complete One Stop Solution with integrated software (YMS 4.0) to support Industry 4.0. TRI provides high-precision and high-resolution PCBA inspection solutions, including 3D Solder Paste Inspection (3D SPI), 3D Automated Optical Inspection (3D AOI), 3D Automated X-ray Inspection (3D AXI, upgradable to Computed Tomography), Manufacturing Defect Analyzers (MDAs), and In-Circuit Test equipment (ICT). The Yield Management System (YMS 4.0) software can automatically collect measurement data and images, assisting production line yield and process improvement. Visit booth 908 in TWTC Nangang Hall(4F) to discover how TRI's solutions are helping the industry meet the comprehensive range of manufacturing test and inspection requirements.


  • TR7007Q
    • 100% Shadow-free Quad/Dual Digital Fringe projectors<br />• Optimized Stop-and-Go Design for Maximum Accuracy<br />• SmartWarp Compensation Eliminates Local PCB Deformation<br />• 100% Solder Paste Defect Coverage including Low Bridges...

  • Built upon latest 3D projection technology, the TR7007QI SPI offers industry leading inspection accuracy for the most demanding applications. The inline inspection system automatically optimizes the inspection route for best performance, and TRI’s innovative SmartWarp system compensates for any board warpage during inspection. With a choice of quad/dual projector inspection, the TR7007QI is a versatile SPI solution bringing accuracy and speed to your fingertips.