Hitachi High-Tech Taiwan Corporation

  • Booth: K2281
  • - 1st Floor


  • Wafer Bump X-Ray Auto-Inspection System TUX-8000 S
    In line auto X-ray nondestructive inspection system for wafer bump void detection in semiconductor industry....

  • TUX-8000 can be realized fully automatic In-line X-ray inspection system with the highest magnification and brighter original X-ray tube.

    Applied for micro bump inspection of 8 and 12 inches wafer. The system can be inspected for bump voids, diameter of bump, void percentage of bump and short between bumps under the um-level accuracy.

    Besides our original unique X-ray system can be inspected at low X-ray damage which is less impact for semiconductor die of memories and imagers.