Hesse Asia Limited

Kwun Tong, 
Hong Kong
  • Booth: L1030
  • - 4th Floor

Welcome to Hesse Mechatronics at Booth M958!

Click to view our exclusive Invitation Letter and download the event floor plan at  https://u.eqxiu.com/s/VOLHDl5L?eqrcode=1

Hesse GmbH, founded in 1978, is a German equipment manufacturer delivering high-end semiconductor assembly equipment. Our products include automatic thin- and heavy-wire wedge bonders and ultrasonic flipchip bonders.

Thin Wire Bonder

Bondjet BJ855, designed for challenging applications like 40um ultra-fine pitch with real-time quality control, is featured with a huge bond area and a wear-free bondhead. It delivers rapid bonding speed up to 7+ wires/second for optimal process flexibility and productivity.

Heavy Wire Bonder
Bondjet BJ955/959 single-head and BJ931 dual-head are capable of bonding 100-500 µm Al and Cu wires/power ribbons for applications like power modules, IGBT, automotive devices, CPV panels and RF amplifiers, etc. These machines are equipped with bondhead integrated pull testers, active wire cutter, E-Box (bondhead set-up visual aid), anti-vibration system, and the powerful patented PiQC real-time quality control system as well.

More to come

Other products' information, more detailed explanations and demonstrations are available on-site with our professional service engineers standing by to help. Welcome to visit us at #M958!