Hesse Asia Limited

Kwun Tong, 
Hong Kong
  • Booth: L1030
  • - 4th Floor


Welcome to Hesse Mechatronics at Booth L1030!

Click to view our exclusive Invitation Letter and download the event floor plan at  https://u.eqxiu.com/s/VOLHDl5L?eqrcode=1

Hesse GmbH, founded in 1978, is a German equipment manufacturer delivering high-end semiconductor assembly equipment. Our products include automatic thin- and heavy-wire wedge bonders and ultrasonic flipchip bonders.

Thin Wire Bonder

Bondjet BJ855, designed for challenging applications like 40um ultra-fine pitch with real-time quality control, is featured with a huge bond area and a wear-free bondhead. It delivers rapid bonding speed up to 7+ wires/second for optimal process flexibility and productivity.

Heavy Wire Bonder
Bondjet BJ955/959 single-head and BJ931 dual-head are capable of bonding 100-500 µm Al and Cu wires/power ribbons for applications like power modules, IGBT, automotive devices, CPV panels and RF amplifiers, etc. These machines are equipped with bondhead integrated pull testers, active wire cutter, E-Box (bondhead set-up visual aid), anti-vibration system, and the powerful patented PiQC real-time quality control system as well.

More to come

Other products' information, more detailed explanations and demonstrations are available on-site with our professional service engineers standing by to help. Welcome to visit us at #L1030!


 Products

  • BONDJET BJ855 FULLY AUTOMATIC THIN WIRE BONDER
    Fastest bonding speed in the industry; Largest working area; Greatest axis accuracy<br /><br />...

  • The Bondjet BJ855 is the successor of the proven Bondjet BJ820, the world's leading fully automated fine wire wedge-wedge wire bonder. It has the advantages of:

    Fastest bonding speed in the industry;
    Largest working area;
    Greatest axis accuracy


    New features: 
    ■ Optimized pattern recognition (PR)
    ■ Industry 4.0 and software features for the growing demand of connectivity
       (e.g. Hesse Bonder Network, remote control of PR, improved MES integration, ...)
    ■ Hesse Assist Tools: load cell, bondtool and wire spool detection, bond tool calibration without wedge gauge for operator independency 

    Typical applications are components in RF technologyCOBMCMhybridsoptical and automotive electronics