Heraeus Materials Technology Taiwan, Ltd.

  • Booth: I2408
  • - 1st Floor

Heraeus Electronics - Your Materials Solution Partner

A globally leading technology group, Heraeus is headquartered in Hanau, Germany. Founded in 1851, it is a family-owned portfolio company which traces its roots back to a pharmacy opened by the family in 1660. Today, Heraeus combines businesses in the environmental, energy, electronics, health, mobility and industrial applications sectors.

In the 2018 financial year, Heraeus generated revenues of €20.3 billion. With approximately 15.000 employees (including staff leasing) in 40 countries, the FORTUNE Global 500-listed company holds a leading position in its global markets. Heraeus is one of the top 10 family-owned companies in Germany.

With technical expertise, a commitment to excellence, a focus on innovation and entrepreneurial leadership, we are constantly striving to improve our performance. We create high-quality solutions for our clients and strengthen their long-term competitiveness by combining unique material expertise with leadership in technology.

Heraeus Electronics – a Global Business Unit of Heraeus Group – is one of the leading manufacturers of materials for the assembly and packaging of devices in the electronics industry.  We develop sophisticated materials solutions for consumer electronics and computing, automotive, LED, power electronics and communications. Core competences include bonding wires, assembly materials, thick film pastes as well as roll clad strips and substrates, and their integration into perfectly matched systems.


  • AgCoat™ Prime
    1st in the world to showcase an innovative product that substitutes costly gold wires for memory packaging. Introducing AgCoat™ Prime – a gold coated silver wire which provides uncompromised reliability and workability with lowest cost of ownership. <br />...

  • Memory devices in the semiconductor industry rely heavily on gold for wire bonding. While electronic devices are constantly evolving and need more storage capacity, the need for cost-effective production is growing.

    With AgCoat™ Prime Heraeus offers a real alternative to gold wire for the memory device packaging. AgCoat™ Prime is a silver alloy bonding wire coated with a layer of gold. Because AgCoat™ Prime's specifications are closely aligned to gold bonding wire, no inert gas is required, so no investment or changes to production equipment and facilities are necessary.

  • Advanced Packaging Solder Pastes
    Heraeus System in Package (SiP) solder pastes meet the high requirements of fine pitch applications with especially designed advanced compatibility....

  • Heraeus advanced packaging products are using type 5 to type 7 fine powders, produced with the Heraeus proprietary Welco technology that results in unique powder properties: Superior quality and sphericity of Welco® powders enable fine pitch applications down to 80 µm.

    The unique compatibility of the System in Package involving Welco®AP5112, Smartflux, SOP92131 and SOP92132 come with similar reflow profiles without splashing or solder loss issues. Products are available halogen-free, zero-halogen or halogen-containing depending on your requirements.

  • mAgic Sinter Paste (Pressure and Non-Pressure)
    Higher power densities come along with a higher operation temperature. At the same time, devices must last longer. Silver sintered pastes offer a robust lead-free alternative to solder pastes increasing the lifetime of the device up to 10 times....

  • Silver based sintering technology is suited for high operation temperatures due to its pure Ag die attach layer. They also provide excellent thermal conductivity and at the same time a longer lifetime compared to solder.

    The Heraeus mAgic series sinter material is suitable for power applications on DCB (pressure sintering) as well as for lead frame packages (non-pressure sintering).