JC's Chunson Limited

Zhong-He,  New Taipei City 
Taiwan
  • Booth: N0562
  • - 4th Floor


Welcome! Visit us at Booth# N0562.

JC’s Chunson Limited was established at Taipei in 1997. We are specialized in the semiconductor and photovoltaics machines and measurement instrument. We represent in China and Taiwan for G&N - Solar Brick Grinder, Wafer Grinder; E+H - PV and SEMI Wafer Thickness, Warp Gauge, Non-Contact Resistivity Gauge; Sentronics - Optical measurement system for Thickness (Thin-Wafer, Glass, Tape, MEMS), Warp for PV Cell; Hologenix - Magic Mirror, Wafer Edge Defect Detection System; Intego-NIR Inspection of Silicon Bricks and 3D Geometry Measurement, Wafer and Cell Detection of Microcracks and Inclusions.

Our goal is to provide the best-quality service and support to our customers. Please feel free to contact us at website:www.chunson.com


 Products

  • sentronics 全自動光學式晶圓厚度、翹曲度檢測設備 (SemDex A32)
    sentronics 全自動光學式晶圓厚度、翹曲度檢測設備 Fully Automatic Wafer Inspection System (SemDex A32)...

    • 全自動裝載,全自動測量
    • 獨立的標準設備,帶有1 (A31)或2 (A32) 裝載口 (前開式晶片盒, Open Cassettes)
    • 300 mm (12"), 200 mm (8“) 晶片, 也可進行組合
    • 用於小於0.1 mm晶片重複鋪放的定線器
    • 傳輸速率可達60片晶片/小時(依據不同的測量方案甚至可能超出該數值)
    • 可手動裝載小於300 mm (12“)的晶片
    • 加框晶片和未加框晶片,可雙面測量
    • 單、雙、三或四感測器配置
    • 可選擇真空夾盤,也適用於雙面測量
    • 集成的用於晶片固定的真空發生裝置
    • 可選購帶有高解析度的HD CMOS攝像機
    • 帶有空氣彈簧並且具有抗扭強度的測量板,測量操作過程中不會發生搖擺
    •  x/y精密測量台,帶有精密步進電動機定位功能
    • 集成於夾盤中的校準體(層厚,3D輪廓,粗糙度)
    • 用於無塵室的帶有塗層的鋼質外殼或不銹鋼外殼
    • 符合半導體行業標準S2和S8的人體工學原理
    • 軟體易操作:WaferSpect
    • SECS/ GEM套裝軟體——在生產與設備之間集成安裝的通訊介面

    • Fully automatic loading, automatic measurement
    • Standalone instrument with 1 (A31) or 2 (A32) loading ports (FOUPs, Open Cassettes)
    • 300mm (12"), 200mm (8") wafers, also combinable
    • Aligner for reproducible placement of the wafers to within 0.1mm
    • Throughput: up to 60 wafers/hour (or even more, depending upon the measurement protocol)
    • Manual loading of wafers up to 300mm (12") is feasible
    • Framed and unframed wafers, measurable on both sides
    • Single, twin, triple, or quadro sensor configuration
    • Optional vacuum chucks, also for measurement of both sides
    • Integrated vacuum generation for fixing wafers
    • Optionally available with high-resolution HD CMOS camers
    • Air-suspended measuring table for vibration-free measurement
    • x/y-precision measuring stage with precise stepping motor positioning
    • Calibration body integrated into chuck (layer thickness, 3D-topography, roughness)
    • Coated steel housing or stainless steel housing for clean room operation
    • SEMI S2- and S8-compliant ergonomics
    • User-friendly WaferSpect software
    • SECS/GEM software package - integrated communication interface between fabrication and device
  • sentronics 光學式晶圓厚度、翹曲度量測儀 (SemDex 301)
    sentronics 光學式晶圓厚度、翹曲度量測儀 Contactless Layer Thickness Measurement (SemDex 301)...

    • 適用於 bumped wafer, multifoils wafer in  packaging, photoresist layer, Tape MEMS, SOI Wafer, GaAS, Glass, Ceramics, TSV等
    • 可同時顯示多層不同材料厚度(最多8層)
    • 量測光點直徑最小(min. 20 μm)
    • 單一機台同時適用多種不同晶片尺寸( 2" ~ 12" )
    • 內建翹曲度及內應力(Stress)量測,並可選配粗糙度(Roughness)量測功能

    • Manual loading, automated measurement
    • Standalone instrument with integrated PC and monitor
    • Accepts wafers measuring up to 300mm (12"), for measurement on both sides
    • Framed and unframed wafers
    • Single, twintriple, or quadro sensor configuration
    • Optional vacuum chucks, also for measurement of both sides
    • Integrated vacuum generation for fixing wafers
    • Optionally available with high-resolution HK CMOS camera
    • Air-suspended measuring table for vibration-free measurement
    • x/y-precision measuring stage with precise stepping motor positioning
    • Calibration body integrated into chuck (layer thickness, 3D-topography, roughness)
    • Coated steel housing or stainless steel housing for clean room operation
    • SEMI S2- and S8-compliant ergonomics
    • User-friendly WaferSpect software
    • Optional: SECS/GEM software package - integrated communication interface between fabrication and device
  • Hologenix 晶圓表面缺陷檢查設備 (NGS 3500L)
    Hologenix 晶圓表面缺陷檢查設備 Advanced Metrology System (NGS 3500L)...

    • 多組高解析度CCD攝影機同時擷取晶片邊緣影像
    • 先進影像處理軟體可快速顯示晶片缺陷發生位置與數量
    • 高產能全自動機台設計,最快每片12"晶片可於30秒內完成缺陷檢查
    • 缺陷檢查重複性極佳,適用範圍如: Polish, EPI, Oxide…等
    • 可檢查 Cracks, Chips, Scratches, Pits 及其他等

    • Automated slip line and defect detection
    • For patterned and Un-patterned wafers
    • Sophisticated automatic defect detection software
    • Customized defect detection algorithms available
    • Suitable for Semiconductor Wafer, MEMS, Hard Disc, Advanced Package
  • E+H 非接觸式晶圓量測儀 (MX204-8-21-V)
    E+H 非接觸式晶圓量測儀 Contactless Wafer Geometry Gauge (MX204-8-21-V)...

    •  6"/8"薄晶圓專用,可量至100μm
    • 可加機械手臂傳送,可量厚度、TTV、翹曲度
    • 個人電腦操作,資料處理簡便
    • 高產能,可達80wafer/hr以上
    • 搭配研磨機,做厚度,翹曲度控制
    • 不刮傷晶圓,可用產品直接測量,節約控片成本
    • 支援SECS/GEM傳輸協定
    • 支援Wafer Studio 3D顯示功能

    • Automatic wafer geometry gauge
    • Wafer diameter 6” and 8”
    • Thickness range 100 – 700 µm
    • Accuracy 1 µm, Resolution 0.1 µm
    • Software MXNT, Wafer Studio
  • E+H 全自動晶圓量測儀 (MX2012-H)
    E+H 全自動晶圓量測儀 Automatic wafer geometry gauge (MX2012-H)...

    • Wafer diameter 12"
    • Thickness range 500 - 900µm
    • Accuracy 1µm
    • Resolution 0.1µm
    • Software MXNT
  • G&N 晶片研磨機 (MPS 2 R300DCS)
    G&N 晶片研磨機 Wafer Grinder (MPS 2 R300DCS)...

    • 穩定度高,CoO(Cost of Ownership)最低
    • 鑽石磨輪適用各種半導體材料(Si or GaAs III-V group) 精密陶磁、金屬或玻璃材料之研磨
    • 真空吸著固定材料,厚度設定可由面板任意輸入
    • Table直徑300mm
    • 研磨輪可選用#400~#200

    • Capable to grind Si and III-V group wafers
    • Variable thickness by key input
    • Reliable, lowest cost of ownership
    • Various grinding wheel from #400 ~ #2000