Welcome to Jipal booth M 0348 (4F) !!!
JIPAL CORPORATION is a professional agent for Semiconductor Packaging / LED/Solar/ SMT equipment and materials and providing after -sales and technical service support.
Products:
Allteq:Die Coater & Post W/B Inspection.
Aurigin:Advanced Solder Ball Placement.
Asahi: Auto Transfer Molding System,
Capable: Professional Mold Chase / kit.
Furukawa:UV Tape for Dicing, Grinding & BGA Singulation, Die Attach flim Adhesives DAF &FOW.
Fasford:LOC/BOC Die Bonder.
GSP: Fully Auto Jig Saw Singulation System.
Hitachi (Tohken) : X-ray Inspection System.
Hitachi (Aimechatec) : Ball Printing System.
Hover-Davis: The feeder expert, Tape & Reel Feeder, Label Feeder.
IKK: New Module Trim/Form System.
KLA-Tencor: Wafer Inspection, Component Defect Inspection.
Kinergy:QFN buffing Machine.
MKE: Bonding Wire.
Okamoto:Wafer Back Grinder & Polisher.
Orion : High Through-put TCB Bonder.
PAL:Ni/Au copper plating line for BGA Substrate.
Teikoku:Wafer Mounter & Taper/Detaper.
UBCT: Factory Automation Solution Provider.