JMJ Korea Co., Ltd

Gyeonggi-do, 
Korea (South)
  • Booth: I2927
  • - 1st Floor


Welcome to JMJ Korea, Global provider of Cu Clip, tool&Equip

JMJ Korea is manufacturer of Clip and fully automatic Clip mount equipment. 

JMJ founded in 2007, and were certified to global semiconductor company such as TI/ ON SEMI/ IMI/DIODES/ NEXPERIA/ SAMSUNG/ TEAM PACIFIC/ MITSUMI/ INFINEON/ ALPHA&OMEGA/ ST/ LG/ IMI/ ASE/ AMKOR/ UTAC/ CARSEM/ PSI etc., 

 Our headquarters are located in Bucheon, near Incheon Airport in Korea. There is branch in the Philippines and agent offices at Malaysia and Singapore. We also have a plan to set up an agent in Taiwan. 

JMJ Korea posted 10M US$ in exports in YEAR 2018, and our main products are Cu Clip, Cu Clip tie bar cutting tool and equipment.

JMJ Korea is producing various products and equipment and proto type packaging service. 
  - Cu Clip: Stamped reel, etched reel, etched gang including Ag plating & ultrasonic welded slug option.
  - Cu Clip tie bar cutting tool set
  - Equipment: Fully automatic Cu Clip mounter which is 4~5x faster than existing clip mount machine, and solder paste jet printer with Piezo ejector.                                              - Support prototype package development to shorten time to market for new package design

We've been working on technology development resulted in 45 patents registered and 25 pending patents in Korea and oversea countries. 

We also acquired international quality certification such as ISO9001/14001 and have a certification plan for IATF16949 this year. 

As always, we eager to support customer's needs as much as possible, and we are shipping quality products to our customers


 Press Releases

  • JMJ Korea is a manufacturer of high-tech semiconductor components related to stamped and etched Cu clip/slug in both reel or strip form. JMJ Korea is also provide MCM C2000S, high UPH multi clip mount machine which can attach multiful clips from high density reel clips per each single stroke so that UPH can be improved 4 to 5 times over existing clip attach equipment. We can also provide high clip attach quality because of burr up singulation  which can eliminate electrical short. All dispensed die and clip attached units are inspection through auto vision inspection system which can edit and upload 2D strip map file to strip mapping system.

 Products

  • MCM C2000S (Multi Clip Mounter)
    Multiple Cu Clip mounter with High speed, High quality, Low Cu Clip cost.<br />...

  • Multiple high density Cu clips are singulated and attached on lead frame per each single stroke so that UPH can be improved by 3~5 times over existing clip attach equipment. Cu Clip cost can be decreased by means of high density Cu clip which is expanded to LF pitch after clip singulation. We can also provide high quality clip attach because cutting burr occurs upward which can eliminate electrical short to die and lead fingers. All dispensed solder paste and clip attached units are inspected through vision inspection system. Based on Inspection results, strip map file downloaded from 2D strip mapping system can be edited and uploaded to 2D strip mapping system.

  • Clip tie bar cutting tool set
    Clip tie bar cutting tool set can be delivered within 4 weeks with lower price. <br />Tie bar of clip is controlled +/-50um. Cutting burr is controlled within 25um.<br />...

  • Many of Clip tie bar cutting tool set has been shipped to various customers to support customer's requirement on fast delivery and low price.  We are shipping Clip tie bar cutting tool set after buy off with following criteria.

    • Tie bar protrusion: +/-50um
    • Cutting burr: 25um max.
    • Cutting tool Up/down movement
    • Clip visual inspection for deformation
    • Vacuum Pick up test (Vacuum Level 70%)
    • Functional Test of feeding error sensor
    • Noise spec (80 Db MAX)
  • Stamped & Etched Cu clip
    Clip is a material that inter-connects die and lead/slug requiring for semiconductor packaging with lower cost and higher thermal and electrical conductivity than traditional Au wiring method....

  • Clip is a material that inter-connects die and lead/slug requiring for semiconductor packaging with lower cost and higher thermal and electrical conductivity than traditional Au wiring method. Although the etched clip is expensive than stamped clip, etched reel clip is generally used for some of complicated clip design or initial clip development to reduce development cost. Etched gang clip was developed to eliminate tie bar singulation process during clip attach. Gang clips are singulated during package saw singulation process which is final process for Power QFN.    JMJ Korea shipped clips to many customers with reel or gang form. 

  • MPT(Micro Pattern Treatment) technology
    JMJ Korea can provide MPT on lead frame or clips to improve delamination....

  • JMJ Korea can provide MPT on lead frame or clips to improve delamination. We can remove the Plasma or coating process, and provide cheaper cost than Roughened Cu as we are using automatic grooving machine for reel clips and/or lead frame strips. We can use the low cost EMC with MPTed LF and Clips.

  • Prototype packaging service
    Prototype packaging service to shorten time to market...

  • Prototype packaging service to shorten time to market: JMJ Korea can support packaging development including design of lead frame/clip/DBC/slug to accommodate device's requirement. We can support various packaging as like series of TO/SOT/LPAK and case & molded power modules. we can support Au/Cu/Al wire as well as Ribbon bond & Clip attach to interconnect between die and leads.

  • JP-J1000
    High accurate and high speed solder paste jet printer with low solder paste waste....

  • We have used the screen printer or Pneumatic dispenser to dispense solder on lead frame or die top surface. However, we have been encountering high solder paste usage/ screen clogging problem with screen printer and dot volume control problem with pneumatic dispenser. To solve all those problems encountered with existing equipment, Jet Printer adopt a high speed plying-jetting piezo ejector with paste temp control to not only keep the dot volume constant but also improve the UPH by 3~5 times. Jet printer can reduce waste of solder paste. We can prepare new job automatic generated program off-line with Gerber or CAD file and send to machine.  We can select different dot size/volume from 0.33mm/5nL and 0.47mm/15nL to 0.52mm/20nL. Machine has a self calibration function for automatic solder dimension calibration and automatic parameter adjustment. 2D inspection can be added as option for 2D solder inspection with 200mm2 per sec.