The projection scanner DSC300 Gen 2, suitable for wafer sizes up to 300mm, utilizes latest technologies of projection lithography. The system is designed to meet the requirements for wafer-level packaging, 3D packaging and bumping application and is ideal for emerging packaging applications such as CU pillar bumping and wafer-level chip-scale packaging. With its optical performance, alignment accuracy and high level of automation the system represents the latest projection scan technology. The scanning technique results in excellent image uniformity across the wafer (+/- 3%).
With the projection scanner DSC300 Gen2, SUSS MicroTec offers a complementary technology to its mask aligner portfolio and a lowest cost of ownership alternative for traditional projection stepper lithography.