UnitySC

Montbonnot-Saint-Martin, 
France
http://www.unity-sc.com
  • Booth: J2750
  • - 1st Floor


Inspection & Metrology Tools in Semiconductor Manufacturing

ADVANCED TECHNOLOGIES IN AUTOMATED OPTICAL INSPECTION AND 3D IMAGING

UnitySC is recognized worldwide as a key player in inspection and metrology, combining advanced technologies in automated optical inspection and 3D imaging with microscopy, temporal-mode interferometry, and spectrometry, which enables customers to deliver higher yields and faster time to market. Customers include the largest foundries, integrated device manufacturers, outsourced semiconductor assembly and test service providers, and R&D centers. The company provides standard and customized advanced process control solutions adapted to specific industrial needs and constraints, enabling a new era in process control. Headquartered in Grenoble, France, the company maintains offices in Taiwan and is supported by a network of representatives.

Unity SC extend the footprint to service its customers regionally and locally : Europe, Korea, Singapore, Taiwan, Japan, USA and China with its New JV in Shenzhen. The served markets : Mobile – Wireless IoT, Automotive Electrification, High performance Computing – Memory – Photonics.


 Press Releases

  • Together with a key player in the VCSEL market, Unity-SC was able to improve their yield by sorting out wafers that presented defects only visible using the LIGHTsEE PSD™.

    If not detected, these defects can lead to failure later in the process or after system delivery.


    GRENOBLE, FranceJuly 17, 2019 /PRNewswire/ -- Over the last decade, VCSEL have shown an increasing interest in many fields for their unique optical and electrical properties, coupled with their high advantages in terms of in-line testing and manufacturability. Mostly based on GaAs wafers for Red to IR wavelength, they are widely used in Lidar and 3D recognition technologies. Thanks to automotive applications, Lidar market is growing fast, as the need for failure free devices. 3D sensing also represents a very large market, as smartphone manufacturers are now embedding such sensors for face recognition. As such, the need for high quality and reliability GaAs inspection systems is growing constantly.

    On top of common Surface Scanning Inspection Systems (SSIS) and Automatic Optical Inspection (AOI) systems, UnitySC demonstrated its unique capacity of detecting otherwise invisible topographic defects. These defects are not visible on standard optical inspection systems, since they do not scatter or absorb light, and can only be revealed by their topography. While they have little impact on the structural quality of the substrate itself, they can lead to device failure later on the process. For example, during the production of the Bragg grating reflectors, these topographic defects can lead to wrong Bragg period or, in some specific cases, to stress-induced cracks. These failures can happen during the process or after system delivery under heat or stress conditions resulting in system failure.

    Thanks to the Phase Shift Deflectometry technology (PSD) embedded inside the LIGHTsEE™ series, these defects can be easily detected. The PSD provides a full wafer, non-contact, high throughput solution with a height sensitivity below 5nm. Since the acquisition is made without moving the substrate, it is stress-free and compliant with any fragile substrate.

    This technology was demonstrated with a major VCSEL manufacturer and revealed a yield improvement and a decrease in device failures by systematically supress dies impacted by such defects. Therefore, by using the PSD in incoming quality control, VCSEL manufacturers can further increase their yield and improve their supply chain.

    About UnitySC

    UnitySC, headquartered in Montbonnot, France, is recognized worldwide as a key player in inspection and metrology, combining advanced technologies in automated optical inspection and 3D imaging with high depth of focus line scanning, temporal-mode interferometry, spectrometry and phase shift analysis. This enables customers to deliver higher yields and achieve faster time to market. We provide standard and customized solutions adapted to specific industrial needs and constraints, enabling a new era in process control. Learn more at unity-sc.com.


    Unity Semiconductor SAS 
    611 rue Aristide Bergès, Z.A. de Pré Millet 
    38330 MONTBONNOT SAINT-MARTIN (France
    T. 33-(0)-4-56-52-68-00 - F. 33-(0)-4-56-52-68-01 
    e-mail : contact@unity-sc.com  
    www.unity-sc.com

    SOURCE www.unitysc.com

    Related Links

    https://www.unity-sc.com

  • UnitySC Unveils a New Metrology Platform for Advanced Packaging & Wafer Processing Ecosystem in Semiconductor Manufacturing

    UnitySC continues to innovate itsinspection and metrology products to deliver solutions that address the most advanced needs across semiconductor manufacturing processes.

    Grenoble, France (July 1st, 2019)— UnitySC European leader and Key player in inspection and metrology solutions, today launched Unity_ATHOS ™ system for 2D/3D advanced metrology and process control in High Density Fan-Out, Embedded Fan-Out and heterogeneous packaging with and without TSV.

    Unity_ATHOS ™ new inspection and metrology system has been designed to address multiple applications including Die stacking control in Die to Wafer hybrid bonding for heterogeneous packaging, MOLD compound thinning and 3D void detection, High Density TSV (from etching to Cu nail revealing), µbump and RDL down to s/l 1/1 µm S/L.

    The new released Unity_ATHOS ™platform is up to 30% faster, more accurate and with lower cost of ownership than previous TMAP generation and it is developed to meet our customer’s more advanced roadmaps as result of extended discussion with our key partners. Thanks to its modularity design, it can be configured according to each customer needs to allow flexibility and no compromise on performances.

    Unity_ATHOS ™ solution can also support the control of manufacturing processes at OSAT, Foundry and IDMs in the Frontend and Backend critical processes like wafer thinning and dicing.

    Unity_ATHOS ™ system can be configured to process wafers and panels up to 300mm, including thin wafers, reconstructed wafers, and wafers mounted on dicing frames.

    The combination of NIR/VIS Optical Microscopy with Wide Band Interferometric and confocal chromatic techniques allows for 2D & 3D inspection for the frontside and backside of the wafer to secure the process development and succeeding High Volume manufacturing.

    Unity_ATHOS ™   system is proposed today in standalone with up to three 300mm load-ports configuration, it is compatible with ISO 5 to ISO 2 manufacturing, and ready to be integrated in the same cluster of LighTiX product.

    “We are proud at UnitySC to announce the release of the newly designed process control solution to serve our partners in the Semiconductor Industry and more specifically in the Advanced packaging. This new product joins the existing process control solution based on LighTiX, LightsEE & LightSpeed. It is expected to contribute significantly to consolidate the position of UnitySC as the market leader of customer-oriented solutions for the Advanced packaging arena and a partner to secure challenging manufacturing processes” said CEO of Unity SC Kamel Ait-Mahiout.

    For more information about the new inspection suite, please visit UnitySC team at SEMICON® WEST, IMAPS 2019 or go to the UnitySC website: www.unity-sc.com.

  • CEA-Leti and UnitySC Announce Further Development To Fuel Industry 4.0 with Smarter Tools

    SAN FRANCISCO – July 10, 2019 – Leti, a research institute of CEA Tech, and UnitySC, a wholly owned subsidiary of FOGALE Nanotech Group and a leader in inspection and metrology solutions for advanced semiconductor packaging, today announced a four-year extension of their collaboration to further advance metrology-inspection capabilities per tool, while reducing the tools’ footprint and cost of ownership.

    CEA-Leti and UnitySC have been working on the development of a metrology-inspection platform for the past four years. The initial targeted applications were 3D integration modules, specialty bonding, and CMP. So far, the collaboration has helped advance UnitySC’s system from a table-top tool to a fully automated 200-300 mm Swiss Army knife-like platform that has shown very good performance during the validation phase. Today, UnitySC and CEA-Leti extend this collaboration to finalize the improvement of the platform and enhance its application space.

    The extended collaboration also will address smarter tools for Industry 4.0. CEA-Leti and UnitySC will specifically work towards improving the platform’s ease of use and reliability, enhancing the multi-sensor approach of today tools, and bringing intelligence to the platform by adding innovative artificial intelligence (AI) approaches.

    This new generation of the platform, announced during SEMICON West, will allow users to tackle several control problems on different applications. These include buried interface defects on Si and GaN, and SiC edge defectivity control, as well as etch and roughness, bonded wafers and chip-to-wafer alignment, among others.

    About UnitySC (France)

    UnitySC, the only French company in Semi equipment for Metrology and inspection, Leader in Europe, Leading the Power and advance packaging Market headquartered in Montbonnot near Grenoble. Unity SC tools combine advanced technologies in automated optical inspection and 3D imaging with microscopy, temporal-mode interferometry, and spectrometry, which enables customers to deliver higher yields and faster time to market solutions to our customers. They are supplying all the largest tier one player in the semiconductor industry. We are extended the footprint to service its customers regionally and locally: Europe, Korea, Singapore, Taiwan, Japan, USA and China with our New JV in Shenzhen.

    About CEA-Leti (France)

    Leti, a technology research institute at CEA Tech, is a global leader in miniaturization technologies enabling smart, energy-efficient and secure solutions for industry. Founded in 1967, Leti pioneers micro-& nanotechnologies, tailoring differentiating applicative solutions for global companies, SMEs and startups. CEA-Leti tackles critical challenges in healthcare, energy and digital migration. From sensors to data processing and computing solutions, CEA-Leti’s multidisciplinary teams deliver solid expertise, leveraging world-class pre-industrialization facilities. With a staff of more than 1,900, a portfolio of 2,700 patents, 91,500 sq. ft. of cleanroom space and a clear IP policy, the institute is based in Grenoble, France, and has offices in Silicon Valley and Tokyo. CEA-Leti has launched 60 startups and is a member of the Carnot Institutes network. This year, the institute celebrates its 50th anniversary. Follow us on www.leti-cea.com and @CEA_Leti.

    CEA Tech is the technology research branch of the French Alternative Energies and Atomic Energy Commission (CEA), a key player in innovative R&D, defence & security, nuclear energy, technological research for industry and fundamental science, identified by Thomson Reuters as the second most innovative research organization in the world. CEA Tech leverages a unique innovation-driven culture and unrivalled expertise to develop and disseminate new technologies for industry, helping to create high-end products and provide a competitive edge.

     

      Press Contact

    Leti/Agency

    +33 6 74 93 23 47

    sldampoux@mahoneylyle.com

     

     


 Products

  • ATHOS
    ATHOS is the combination between wide technology solution portfolio and extreme measurement accuracy. Several optical technologies are embedded to characterise from topography through 2D metrics to global thickness without any impact on the sample....

  • Key Features

    Fast and high throughput in-line metrology solution.

    • Area scan with vertical resolution down to 0.1nm in a single measurement
    • Material segmentation on transparent layers -Patented
    • Unique capabilities for Cu to Cu hybrid bonding
    • Thickness measurement range from nanometers to millimeters of stacks transparent to VIS/NIR
    • Dual-distance mode to measure opaque layers and/or mix of transparent/opaque stacks
    • Bow, Warp, TTV
    • VIA depth & top/bottom CD
    • Trench depth / Height CD / side slope of steps & RDL
    • Coplanarity & CD for nails/bump, RDL, UBM height
    • Edge trim metrology
    • Nano-Scale Topography (roughness) & surface profiling
    • Overlay and lateral critical dimensions
    • Defect Inspection at surface & at bonding interface by NIR Microscopy with Reflection/Transmission
        Learn more about UnitySC solutions on http://www.unity-sc.com
  • TMAP
    The TMAP Series provides highly accurate and repeatable wafer geometry measurements such as thickness, CD, TTV, bow/warp, roughness, overlay, for all kind materials even under highly warped conditions....

  • Key Features

    A Versatile Metrology Solution

    Measurement capabilities:
    • Thickness measurement range from nanometers to millimeters of stacks transparent to VIS/NIR
    • Dual-distance mode to measure opaque layers and/or mix of transparent/opaque stacks
    • Wafer bow. warp. TTV
    • VIA depth & top/bottom CD
    • Trench depth / Height. CD. side slope of STEPs & RDL
    • Nails/bump. RDL. UBM height/coplanarity & CD
    • Edge trim metrology
    • Nano-Scale Topography (roughness) & surface profiling
    • Stress. Air gap measurement. RST for Nail reveal
    • Overlay and lateral critical dimensions
    • Defect Inspection at surface & at bonding interface by NIR Microscopy with Reflection/Transmission

        Learn more about UnitySC solutions on http://www.unity-sc.com
  • NST
    The NST Series is a non contact full field metrology solution based on optical microscopy enabling surface topography measurement at the nano scale.<br />The NST Series is pushing the boundaries of conventional microscopy....

  • Key Features

    For hybrid bonding 

    • Fast and high throughput in-line metrology solution
    • Area scan with vertical resolution down to 0.1nm in a single measurement
    • Material segmentation on transparent layers – Patented
    • Unique capabilities for Cu to Cu hybrid bonding

        Learn more about UnitySC solutions on http://www.unity-sc.com
  • LIGHTiX
    LIGHTiX is an inspection system combining leading edge inspection and metrology technologies integrates confocal chromatic techniques to allow for 2D and 3D inspection as well as characterisation for the front side, back side and edge of the wafer....

  • Key Features

    LightiX is a fully automated high-resolution AOI Tool. Modular Inspections for patterned and non-patterned wafers.

    Front, Back & Edges  Inspection with comprehensive 2D and 3D metrology options.

    • Next generation macro inspection system (AOI).
    • All-side wafer inspection: Front, back and edge inspection.
    • 100% defect images without throughput impact.
    • Integrated high-end microscope review.
    • True Color Inspection (TCI) technology.
    • Advanced CD, 2D/3D, OVL and EBR metrology.
    • Automatic defect classification
    • Best in class cost of ownership for high resolution AOI
    • High-speed patterned wafer inspection
    • High defect sensitivity
    • ISO Class 1 certified
    • Tool – to – tool matching 

      Learn more about UnitySC solutions on http://www.unity-sc.com
  • LIGHTSpEED
    The LIGHTSpEED provides both standard dark-field inspection and advanced Synchronous Doppler Detection Technology ™ that enables the defection of nanometer scale defects both on standard and transparent substrates....

  • Key Features 

    High Sensitivity Dark Field Surface Inspection can be used also for any Material compostion such as opaque transparent wafers

    • High throughput
    • Nanometer scale sensitivity
    • Autofocus
    • Full haze characterization
    • Multisize capability
    • Pits / Particle distinction
    • High lifetime / low CoO solid state laser
    • Advanced Automatic Defect Classification

      Learn more about UnitySC solutions on http://www.unity-sc.com
  • LIGHTnPS
    LIGHnPS provides a high throughput all side wafer inspection for non-patterned substrates. In a single scan, it provides frontside and backside Darkfield inspection as well as edge brightfield inspection....

  • Key Features

    Edge and Backside Inspection with Best in Class CoO.

    • Best in class throughput
    • High surface sentivity
    • Full haze characterization
    • High lifetime / low CoO solid state laser
    • Advanced Automatic Defect Classification

        Learn more about UnitySC solutions on http://www.unity-sc.com