Micronox® MX2708 was formulated for the demanding cleaning challenges presented within leadless devices such as low standoff gaps and fine pitches of BGAs, flip chips, QFNs, LGAs and passives. MX2708 completely removes organic acid residues of all kinds at low, safe operating concentrations all while having no effect on exposed metal and intermetallic alloys including Cu, Al, Sn, Pb, Ni, Ag and Au finishes. Micronox MX2708 is a balanced cleaning agent designed around the critical process conditions that match the cleaning agent with water soluble flux pastes.
- Effectively Cleans Under Highly Dense Die Without Reacting with Exposed Metals
- SAC, Aluminum and Copper Safe
- Lowers Surface Tension
- Superior Rinsing Ability