Sentec E&E Co., Ltd.

Taoyuan County, 
Taiwan
  • Booth: I2013
  • - 1st Floor

Sentec Electro Ceramic & Device Group offers various substrate and IC packaging solutions.
Process Technologies were transferred from Panasonic since year 1999.

Main Product:
‧High Accuracy Multi-Layer LTCC Substrate (X,Y ±0.05%) ex. Interposer/MLC
‧Direct Plating Copper Metallization on Al2O3 & AlN Substrate
‧Hermetic Ceramic Package (QFN, Substrate & CSP)
‧Turnkey Packaging Service (CSP, COB, MCM or SiP)