Taipei City, 
  • Booth: K2190
  • - 1st Floor

Welcome to our booth, we will do our best for your needs.

Samtec, Inc., founded in 1976, is a privately held, worldwide manufacturer of electronic interconnect solutions. Samtec maintains a 5-A1 Dun and Bradstreet rating, the highest available for a corporation this size. Worldwide sales for 2018 were approximately US$822 million. The focus at Samtec is on creating superior capabilities and differentiation within niche products and markets. A carefully designed system of Core Values and Sudden Service® principles assist in achieving this goal.

 Press Releases

  • New Albany, Indiana: Samtec Inc., a privately held $822 MM global manufacturer of a broad line of electronic interconnect solutions, will showcase and demonstrate their latest rugged and high-performance interconnect and technologies at Semicon 2019 in Taipei.

    Samtec high-speed technologies for Silicon-to-Silicon optimization will be on display, including new high-speed, high- bandwidth optical, board-to-board and cable-to-board interconnects, including 56 Gbps PAM4 and 112 Gbps PAM4 products. 

    Featured products at the Samtec booth include:


    • NovaRay™:  The innovative design of NovaRay combines extreme density and extreme performance for 112 Gbps PAM4 per channel, in 40% less space than traditional arrays, for an industry leading 4.0 Tbps aggregate data rate.
    •  Samtec Flyover™:  As bandwidth requirements rapidly increase, routing signals through lossy PCBs, vias and other components have become one of the most complex challenges designers face.  Samtec Flyover breaks the constraints of traditional substrate signaling and hardware offerings, resulting in a cost-effective, high-performance answer to the challenges of 112 Gbps bandwidth and beyond.
    • FQSFP-DD:  Samtec was the first interconnect company to bring the QSFP Flyover product line to market. Samtec is excited to announce another first in the Flyover realm: Samtec’s FQSFP-DD is the first product to take the Samtec Flyover architecture concept to the QSFP-DD form factor.
    • AcceleRate®:  Samtec’s AcceleRate® cable assembly is the slimmest in the industry with a 7.6 mm body width ideal for closer proximity to the IC. The high-density 2-row design features 8 and 16 pair configurations on a 0.635 mm pitch for up to 92 pairs per square inch.

    The products and others can be seen at Booth K2190, Hall 1, at Semicon 2019, at the Taipei Nangang Exhibition Center. The conference is September 18 – September 20, 2019. 

    About Samtec, Inc.

    Founded in 1976, Samtec is a privately held, $822 MM global manufacturer of a broad line of electronic interconnect solutions, including High-Speed Board-to-Board, High-Speed Cables, Mid-Board and Panel Optics, Precision RF, Flexible Stacking, and Micro/Rugged components and cables. With 40+ location severing approximately 125 countries, Samtec’s global presence enables its unmatched customer service. For more information, please visit

    Samtec Taiwan

    +886-2-77274060 #7123

    Kevin Chen (

    Taipei City