PEMTRON

SHENZHEN, 
China
  • Booth: L0820
  • - 4th Floor


 Products

  • ZEUS
    Wafer Bump & Wire Bonding 3D AOI...

  • - The Best 3D WIRE Bonding AOI Inspection System

    - The Best 3D Inspection system for Advanced Packaging

    - High Accuracy die inspection without problems due to reflection

    - AOI + SPI Multi-Hybrid System

    - Small Component Inspection Capability