Chung-Li City, 
  • Booth: L0316
  • - 4th Floor

Visit EVG at the booth # L0316

EV Group (EVG) is a leading supplier of equipment and process solutions for the manufacture of semiconductors, microelectromechanical systems (MEMS), compound semiconductors, power devices, and nanotechnology devices. Key products include wafer bonding, thin-wafer processing, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems. Founded in 1980, EV Group services and supports an elaborate network of global customers and partners all over the world. More information about EVG is available at www.EVGroup.com.


  • EVG®850 TB
    Automated Temporary Bonding System...

  • The fully automated temporary bonding system achieves the whole temporary bonding process – starting with temporary adhesive application, baking, alignment and bonding of the device wafer to the carrier wafer – within one automated tool. The equipment layout is modular as with all of EVG’s fully automated tools, meaning it can be throughput-optimized depending on the specific process. The optional inline metrology module allows total process monitoring and parameter optimization with feedback loops.
    Because of EVG’s open platform, different types of temporary bonding adhesives can be used, such as spin coat thermoplast, thermoset materials, or tapes.


    • Open adhesive platform
    • Various carriers (silicon, glass, sapphire, etc…)
    • Bridge tool capability for different substrate sizes
    • Available with multiple load port options and combinations
    • Recipe controlled system
    • Real time monitoring and recording of all relevant process parameters
    • Fully integrated SECS/GEM interface
    • Optional integrated inline metrology module for automated feedback loop
    Automated Production Wafer Bonding System...

  • Vertical stacking of semiconductor devices has become an increasingly viable approach to enabling continuous improvements in device density and performance. Wafer-to-wafer bonding is an essential process step to enable 3D stacked devices. EVG's GEMINI FB XT integrated fusion bonding system extends current standards and combines higher productivity with improved alignment and overlay accuracy for applications such as memory stacking, 3D systems on chip (SoC), backside illuminated CMOS image sensor stacking, and die partitioning. The system features the new SmartView NT3 bond aligner, developed specifically for fusion and hybrid wafer bonding alignment requirements of < 50 nm.


    • New SmartView® NT3 face-to-face bond aligner with sub 50 nm wafer-to-wafer alignment accuracy
    • Up to six pre-processing modules like:
      • Clean module
      • LowTemp™ plasma activation module
      • Alignment verification module
      • Debond module
    • XT Frame concept for highest throughput with EFEM (Equipment Frontend Module)
    • Optional features:
      • Debond module
      • Thermocompression bond module
  • HERCULES® NIL 300 mm
    Fully modular and integrated SmartNIL® UV-NIL system up to 300 mm...

  • EVG’s HERCULES NIL 300 mm is a fully integrated track system that combines cleaning, resist coating and baking pre-processing steps with EVG’s proprietary SmartNIL large-area nanoimprint lithography (NIL) process in a single platform for wafers up to 300 mm in diameter. It is the first NIL system based on EVG’s fully modular equipment platforms with swappable modules to give customers maximum freedom to configure their systems to best meet their production needs, including bridge capabilities for 200 mm and 300 mm wafers.

    The HERCULES NIL 300 mm provides the most advanced nanoimprint capabilities on the market with low force and conformal imprinting, fast high-power exposure and smooth stamp detachment. The system supports the production of a variety of devices and applications, including optical devices for augmented/virtual reality (AR/VR) headsets, 3D sensors, bio-medical devices, nanophotonics and plasmonics.


    • Fully automated UV-NIL imprinting and low-force detachment
    • Up to 300 mm substrates
    • Fully modular platform with up to eight swappable process modules (imprinting and pre-processing)
    • 200 mm / 300 mm bridge-tool capability
    • Full-area imprint coverage
    • Volume manufacturing of structures down to 40 nm and smaller
    • Supports a wide range of structure sizes and shapes, including 3D
    • Applicable on high-topography (rough) surfaces

    *resolution dependent on process and template 

    Automated Production Fusion Bonding System...

  • EVG BONDSCALE is designed to fulfill a wide range of fusion/molecular wafer bonding applications, including engineered substrate manufacturing and 3D integration approaches that use layer-transfer processing, such as monolithic 3D (M3D). With BONDSCALE, EVG is bringing wafer bonding to front-end semiconductor processing and helping to address long-term challenges for "More Moore" logic device scaling identified in the International Roadmap for Devices and Systems (IRDS). Incorporating an enhanced edge alignment technology, BONDSCALE provides a significant boost in wafer bond productivity and lower cost of ownership (CoO) compared to existing fusion bonding platforms.

    BONDSCALE is being sold alongside EVG's industry benchmark GEMINI FB XT automated fusion bonding system, with each platform targeting different applications. While BONDSCALE will primarily focus on engineered substrate bonding and layer-transfer processing, the GEMINI FB XT will support applications requiring higher alignment accuracies, such as memory stacking, 3D systems on chip (SoC), backside illuminated CMOS image sensor stacking, and die partitioning.


    • Fully automated fusion/molecular wafer bonding applications on 200 mm and 300 mm substrates in a single platform
    • Also includes cleaning, plasma activation, alignment, pre-bonding and IR inspection
    • Direct wafer bonding with plasma activation for heterogeneous integration of different materials, high-quality engineered substrates as well as thin-silicon layer-transfer applications
    • Layer-transfer processes and engineered substrates enabling logic scaling, 3D integration such as M3, 3D VLSI including backside power distribution, N&P stacking, logic-on-memory, clustered functional stacks and beyond-CMOS adoption
  • IQ Aligner® NT
    Automated Mask Alignment System...

  • The IQ Aligner NT is the most productive and technically advanced automated mask alignment system for high-volume applications. Featuring the most sophisticated print gab control and zero-assist dual-size wafer processing capability, the system fully addresses high-volume manufacturing (HVM) needs. It provides a 2X increase in throughput and a 2X improvement in alignment accuracy over EVG’s previous-generation IQ Aligner system, giving it the highest throughput of all mask aligners. The IQ Aligner NT surpasses the most demanding requirements for back-end lithography applications while providing up to 30 percent lower cost of ownership compared to competing systems growing out of the highest throughput supported on mask alignment tools.. With advanced wafer alignment run-out control, full-field mask movement capability and high-power UV light source, it is ideally suited for wafer bumping and interposer patterning, thereby serving a variety of advanced packaging types, including wafer-level chip scale packaging (WLCSP), fan-out wafer-level packaging (FOWLP), 3D-IC/through-silicon via (TSV), 2.5D interposers, and flip chip.


    • Zero assist bridge tool - dual substrate concept supporting flexibility of production for 200 mm and 300 mm
    • Throughput > 200 wph (first print)
    • Cutting-edge alignment accuracy
      • Top-side alignment down to 250 nm
      • Back-side alignment down to 500 nm
    • Broadband intensity > 120 mW/cm² (300 mm wafer)
    • Full Clearfield Mask Movement (FCMM) for flexible pattern positioning and compatibility for darkfield mask alignment
    • Contact-free in-situ mask-to-wafer proximity gap verification
    • Excellent run-out compensation thanks to ultra-flat and fast response temperature-controlled wafer chuck
    • Manual substrate loading capability
    • Rework sorting wafer management and flexible cassette system
    • Remote tech support and GEM300 compatibility
    • Smart process control and data analysis feature [Framework Software Platform]
      • Integrated analysis features for process and machine control
      • Equipment and process performance tracking feature
      • Parallel/queueing task processing feature
      • Smart handling features
      • Occurrence and alarm analysis
      • Smart maintenance management and tracking
  • EVG®40 NT
    Automated Measurement System...

  • The EVG40 NT (stand-alone tool) and the AVM (HVM-integrated module) enable measurement of lithography-relevant parameters like critical dimensions, as well as bond alignment accuracy.
    Because of the system’s high measurement accuracy, it is possible to verify compliance to tight process specifications and instantly optimize integrated process parameters.
    With its diverse measurement methods, the EVG40 NT adapts to a large number of manufacturing processes like nanoimprint lithography or wafer-to-wafer bonding simultaneously.
    As an application example, the EVG40 NT completes EVG’s product range for highly accurate aligned wafer bonding as the tool of record for reliably verifying the 100 nm bond overlay accuracy of EVG’s GEMINI FB automated fusion.


    • Versatile measurement options for lithography and bonding metrology
    • Alignment verification for bonding and lithography applications
    • Top- to bottom-side microscope for manifold measurement methods
    • Critical dimension (CD) measurement
    • Die-to-die alignment verification
    • Multi-layer thickness measurement
    • High measurement accuracy in vertical and lateral direction
    • High throughput due to specialized calibration routine
    • PC-based measurement and pattern recognition software for highest reliability