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Since semiconductor manufacturing process has comprehensively moved toward nanotechnology, the resolution of inspection also needs to be enhanced. This increases the dependence on automatic inspection. To meet the market demands, EFC expands the application of current machine, and develops new technologies actively in AOI Industry.
EFC has developed the automatic inspection machine which combined machine vision and images processing technology to meet growing needs in Semiconductor market. The fast and non-contact inspection is used for detecting wafer-surface defect. It can dramatically reduce the inspection time and further improve wafer throughput and yield rate.