SET CORPORATION SA

Saint-Jeoire, 
France
http://www.set-sas.fr
  • Booth: N0962
  • - 4th Floor


Meet SET Flip-Chip Bonders experts on booth # N0962!

Discover SET’s new Production Equipment for Hybrid Bonding

NEO HB 

NEO HB is a flip-chip bonder designed for ± 1 µm @ 3σ accuracy in stand-alone or full automatic mode (EFEM).

It is suitable for hybrid / direct bonding processes.

NEO HB combines high precision, flexibility and short cycle time. It is dedicated for production.

Founded in 1975, based in France, SET is a world leading supplier of High Accuracy Flip-Chip Bonders (chip-to-chip and chip-to-wafer) and versatile Nanoimprint Lithography (NIL) solutions.

With more than 340 equipment installed worldwide, SET is globally renowned for the unsurpassed accuracy and the flexibility of its flip-chip bonders.

Ranging from manual loading to fully automated version, the SET bonders adapt to all main bonding techniques: fluxless reflow, thermo-compression, adhesive joining compression, thermosonic…

SET offers a comprehensive product portfolio of flip-chip bonders for fast growing markets and serving clients through a global network of representatives (DKSH in Taiwan) and in-depth customer trainings.

Visit SET website for more information: www.set-sas.fr


 Products

  • NEW PRODUCT - NEO HB
    The NEO HB is an automatic flip-chip bonder dedicated for production. It allows ± 1 μm @ 3σ post-bonding accuracy....

  • The NEO HB is a flip-chip bonder designed for ±1 μm @ 3σ post-bonding accuracy in stand-alone or full automatic mode (EFEM).

    It is suitable for hybrid / direct bonding processes.

    The NEO HB combines high precision, flexibility and short cycle time.                                           

    It is dedicated for production.

  • ACCμRA M
    The ACCμRA M is a manual flip-chip bonder designed for ± 3 μm post-bonding accuracy....

  • The ACCμRA M permits to align manually the components with a high level of precision.

    More than a pick-and-place system, it offers thermocompression and reflow capabilities.

    It is the perfect equipment for universities and R&D institutes.

  • ACCµRA 100
    The ACCµRA 100 is a semi-automatic flip-chip bonder designed for ± 0.5 µm post-bonding accuracy....

  • Its flexibility makes it ideal for developing a wide range of applications.

    The ACCµRA 100 combines high precision, accessibility and cost-effectiveness.

    It is the perfect equipment for universities and R&D institutes.

  • ACCµRA OPTO
    The ACCμRA OPTO is a flip-chip bonder designed for ± 0.5 μm post-bonding accuracy....

  • The ACCμRA OPTO is dedicated for low force and reflow processes.                 

    Motorized axes guarantee a high repeatability of your process.

    The ACCμRA OPTO combines high precision, flexibility and accessibility.

    It is the perfect equipment for optoelectronics and silicon photonics applications.

  • ACCµRA Plus
    The ACCμRA Plus is a flip-chip bonder designed for ± 0.5 μm post-bonding accuracy in full automatic mode....

  • The ACCµRA Plus is suitable for reflow and thermocompression processes. 

    It combines high precision, flexibility and short cycle time.              

    It is dedicated for production for Optoelectronic and Silicon photonics applications.

  • FC family
    The FC150 and the FC300 are very accurate flip-chip bonders dedicated for R&D and pilot line oriented....

  • The FC150 is a high accuracy and versatile flip-chip bonder for Chip-to-Chip (up to 100 mm) and Chip-to-Wafer (up to 200 mm) applications on the same open platform. 

    It allows ± 1 µm post-bonding accuracy.

    Perfect for advanced R&D, the FC150 is also adapted to pilot production thanks to its full automatization.


    The FC300 is a high accuracy and high force flip-chip bonder for Chip-to-Chip (up to 100 mm) and Chip-to-Wafer (up to 300 mm) applications.

    It allows ± 0.5 µm post-bonding accuracy.

    The FC300 covers a large range of bonding forces, from 1 to 4000 N. That makes it perfectly suitable for reflow and thermocompression processes.