Shibuya Corporation

JAPAN, 
Japan
  • Booth: I3223
  • - 1st Floor

Shibuya - Leading assembly equipment
Shibuya Corporation with subsidiary Kaijo Corporation, is a leading manufacturer of
flip chip and multi chip die bonding, die attach, solder ball placement, wire bonding and
taping eq uipment. Shibuya offers the most complete advanced packaging solution from
one source.