The FC150 is a high accuracy and versatile flip-chip bonder for Chip-to-Chip (up to 100 mm) and Chip-to-Wafer (up to 200 mm) applications on the same open platform.
It allows ± 1 µm post-bonding accuracy.
Perfect for advanced R&D, the FC150 is also adapted to pilot production thanks to its full automatization.
The FC300 is a high accuracy and high force flip-chip bonder for Chip-to-Chip (up to 100 mm) and Chip-to-Wafer (up to 300 mm) applications.
It allows ± 0.5 µm post-bonding accuracy.
The FC300 covers a large range of bonding forces, from 1 to 4000 N. That makes it perfectly suitable for reflow and thermocompression processes.