UDM SYSTEMS LLC

RALEIGH,  NC 
United States
  • Booth: M0858
  • - 4th Floor

UDM Systems®, LLC is a global chemical manufacturing company based in the United States. We offer high-performance products that are suitable for many industries, such as SemiconductorSolarOptoelectronicsBiomedicalLEDPrecision Glass & Optics, and much more. 

Backed by more than 20 years of experience, we are confident that we can help you with all your semiconductor and solar wafer-die needs. We are one of the only companies that makes a water-based, eco-friendly fluid. Our products are competitively priced and supported by our friendly staff. We are dedicated to serving you.


 Products

  • Wafer Dicing Lubricants
    Our L300 Series Dicing Lubricants are ideal for enhancing die-separation process to maximize yields and improve customer profitability....

  • Products 

    UDM L300 D5 Semiconductor Dicing Lubricant 

    Wafer Dicing Lubricant - L300 D5

    Reduction of both electrostatic build up and sawdust surface contamination are essential in today's die separation of ultra-thin semiconductor materials (mobile communication ICs, CCDs and CMOS image sensors). The UDM Systems® L-Series lubricants are specifically designed to reduce electrostatic buildup, enhance lubrication, enabling sawdust dispersion and cleaner bonding pads. 

    • L Series lubricants are biodegradable, non-corrosive aqueous solution 
    • Completely water-soluble 
    • For optimum dicing results, ratio of de-ionized water (DI): L300-01-D5 Series should be between 1000:1 and 1500:1 

    Unique Features 

    • Increase heat transfer and reduce thermal stress 
    • Effectively reduces the surface tension of water 
    • Outstanding wetting properties and excellent rinseability 
    • Enhance wafer cut quality 
    • Increases die yield and reliability, and reduces ESD 
    • Sodium and Potassium free material 
    • Extend Blade life by 20% to 30% 
    • Very mild odor 
    • Biodegradable, non-hazardous and hence easily disposable 

    UDM L300 D5CMOS Semiconductor Dicing Lubricant 

    Wafer Dicing Lubricant - L300 D5CMOS

    Reduction of both electrostatic build up and sawdust surface contamination are essential in today's die separation of ultra-thin semiconductor materials (mobile communication ICs, CCDs and CMOS image sensors). 

    The UDM Systems® L-Series lubricants are specifically design to reduce electrostatic buildup, enhance lubrication, enabling sawdust dispersion and cleaner bonding pads. 

    • L-Series lubricants are biodegradable, non-corrosive aqueous solution 
    • Completely water-soluble 
    • For optimum dicing results, ratio of deionized water (DI): 

    L300-01-D5CMOS Series should be between 1000:1 and 1500:1 

    Unique Features 

    • Increase heat transfer and reduce thermal stress 
    • Effectively reduces the surface tension of water 
    • Outstanding wetting properties and excellent rinseability 
    • Enhance wafer cut quality 
    • Increases die yield and reliability, and reduces ESD 
    • Sodium and Potassium free material 
    • Extend Blade life by 20% to 30% 
    • Very mild odor 
    • Biodegradable, non-hazardous and hence easily disposable 

    UDM L300 N2000 Semiconductor Dicing Lubricant 

    Wafer Dicing Lubricant - L300 N2000

    Reduction of both electrostatic build up and sawdust surface contamination are essential in today's die separation of ultra-thin semiconductor materials (mobile communication ICs, CCDs and CMOS image sensors). 

    The UDM Systems® L-Series lubricants are specifically design to reduce electrostatic buildup, enhance lubrication, enabling sawdust dispersion and cleaner bonding pads. 

    • L Series lubricants are biodegradable, non-corrosive aqueous solution 
    • Completely water-soluble 
    • For optimum dicing results, ratio of de-ionized 
    • Water (DI): L300-01-00 (N2000) Series should be between 2000:1 and 3000:1 

    Unique Features 

    • Increase heat transfer and reduce thermal stress 
    • Effectively reduces the surface tension of water 
    • Outstanding wetting properties and excellent rinseability 
    • Enhance wafer cut quality 
    • Increases die yield and reliability, and reduces ESD 
    • Sodium and Potassium free material 
    • Extend blade life by 20% to 30% 
    • Very mild odor 
    • Biodegradable, non-hazardous and hence easily disposable 

    UDM L300 N2000_B Semiconductor Dicing Lubricant 

    Wafer Dicing Lubricant - L300 N2000B

    For advanced applications, UDM provides the N2000_B, which offers the same superior features and performance of the N2000 but with a higher concentration. 

    The UDM Systems® L-Series lubricants are specifically design to reduce electrostatic buildup, enhance lubrication, enabling sawdust dispersion and cleaner bonding pads. 

    • L Series lubricants are biodegradable, non corrosive aqueous solution 
    • Completely water-soluble 
    • For optimum dicing results, ratio of de-ionized 
    • Water (DI): L300-01-00 (N2000_B) Series should be between 5000:1 and 6000:1 

    Unique Features 

    • Increase heat transfer and reduce thermal stress 
    • Effectively reduces the surface tension of water 
    • Outstanding wetting properties and excellent rinseability 
    • Enhance wafer cut quality 
    • Increases die yield and reliability, and reduces ESD 
    • Sodium and Potassium free material 
    • Extend blade life by 20% to 30% 
    • Very mild odor 
    • Biodegradable, non-hazardous and hence easily disposable

  • Cropping/ Bricking/ Squaring/ Slicing Fluids
    Our AKLC400 family of products is perfect for slicing, bricking, squaring, cropping fluid for Silicon Ingot Sapphire Wafering...

  • AKLC400 is an advanced material developed to revolutionize the wafering process. It offers excellent heat transfer, extends diamond wire life, improves wafer reliability (minimizes wafer breakage) and is extremely environmentally friendly. Our products allow the use of thinner wire to slice thinner wafers and create higher yields. AKLC400 also improves wafer surface cleanliness after wafering. It is 10 times cleaner and only requires minimal cleaning.

    Products 

    UDM AKLC400-SPV Coolant/Lubricant 

    for Silicon Ingot and Sapphire Wafering/Bricking/Squaring/Cropping

    Cropping/Bricking - AKLC400-SPV

    Application: Diamond Wire Sawing Process 

    • AKLC400 Coolant- lubricant is a biodegradable water based, non-caustic material. 
    • Dilution ratio of DI /RO water: Slicing Fluid is 500:1 to 1000:1. 
    • Effectively reduces the surface tension of cutting/slicing water solution to about 22.0 to 25.0 mN/m. 
    • Increases heat transfer (heat dissipation) therefore reducing thermal stress. 
    • Outstanding wetting and rinsing properties. 

    Environmental Benefits and Cost 

    • Biodegradable, non-hazardous and hence easily disposable. 
    • Biochemical Oxygen Demand (BOD) < 12.0 mg/L (BOD less than 12.0 mg/L). 
    • Chemical Oxygen Demand (COD) < 96.0 mg/L (COD less than 96.0 mg/L). 
    • Elimination of slurry management. 
    • No PEG & SiC hazardous waste management 

    UDM AKLC400-AF Coolant/Lubricant Antifoam 

    for reducing foaming in AKLC400-SPV fluid concentrate

    Cropping/Bricking - AKLC400-AF

    Application: Diamond Wire Sawing Process 

    • AKLC400-AF (Antifoam agent) is used in combination with AKLC400-SPV for slicing/wafering silicon ingots. The material is biodegradable, non-corrosive, and completely water soluble. 

    Environmental Benefits and Cost 

    • Biodegradable, non-hazardous and easily disposable. 
    • Biochemical Oxygen Demand (BOD) < 12.0 mg/L (BOD less than 12.0 mg/L). 
    • Chemical Oxygen Demand (COD) < 96.0 mg/L (COD less than 96.0 mg/L).
  • Wafer Surface Cleaning Detergents
    UDM Systems® AKLC300 series of products is ideal for wafer surface precision cleaning detergents....

  • AKLC300 is an excellent wetting and cleaning product with rinsing properties that reduces water surface tension by cleaning out SiC (Silicon carbide) dust and other contaminants on the wafer surface. It also eliminates Copper and Iron on wafer surfaces after the wafering and de-gluing process. Like all our products, it is environmentally safe.

    Products 

    UDM AKLC300 Detergent Concentrate 

    Wafer Surface Cleaning - AKLC300

    • AKLC300 series detergent solution has excellent water softening properties, thus allowing the special blend of surfactants in the product to provide good detergency and emulsification. These properties are essential for rapid cleaning and complete sawdust (swarf) removal. 
    • Dilution ratio of DI/RO water:AKLC300 is 10:1 and 50:1
  • Fluid Dispensing Systems
    UDM Systems® offers various lubricant dispensing systems that are designed to give you enhanced performance....

  • The ADU series system offers manual settings and high capacity, which makes it the favorite tool for most large facilities. The use of high quality pumps and simple saw integration make this reliable workhorse our most popular, with hundreds of installations throughout the globe. 
    The new ADU-E1 is the next generation in the ADU lineup. The ADU-E1 offers the same features and hardware quality of the ADU series, along with sophisticated systems that allows you to control and observe surfactant flow. Users can also connect via MODBUS TCP/IP to observe system condition implement factory automation. 
    The LDS series system is a Windows PC operated closed loop system designed to ensure perfect mixing ratio at all times. 
    UDM Systems® strives to provide the right products to fit your needs, whether for high volume production or research and development work.